tag: reliability

Reversible Chain Diagnosis
By Siemens EDA - 09 Nov, 2021 - Comments: 0

For advanced technologies, the industry is seeing very complicated silicon defect types and defect distribution. One consequence is that scan chain diagnosis becomes more difficult. To improve the resolution of scan chain diagnosis, Tessent Diagnosis can use new scan chain test patterns to leverage a reversible scan chain architecture. This paper describes the novel scan chain architecture t... » read more

Strategies For Meeting Stringent Standards For Automotive ICs
By Prasad Bachiraju - 26 Oct, 2021 - Comments: 0

It may surprise you, but when it comes to chips in electronic braking systems, airbag control units, and more, automotive manufacturers are still using 10-year-old technology — and with good reason. For the automotive industry, the reliability, stability, and robustness of electronic components are critical, especially when it comes to meeting the stringent Automotive Electronics Council (... » read more

Improving Accuracy In Satellite Navigation Systems
By Bryon Moyer - 20 Oct, 2021 - Comments: 0

Increasing dependency on the global navigation satellite system (GNSS) constellations is raising concerns about what happens when signals are unavailable, even for short periods of time. GNSS systems affect our daily lives in ways we often don’t see, from location services to cell phone timing. In fact, these satellites have become a necessary part of critical infrastructure, and higher ac... » read more

Challenges In RF Design
By Roland Jancke - 14 Oct, 2021 - Comments: 0

Designing highly integrated components for radio frequency applications poses special challenges for system engineers, designers and the commissioning engineers. The boundary between chip, package and board is increasingly vanishing on modern components. It is growing more common for parts of the functionality to be moved to the package or even the board. In some cases, the requirements have be... » read more

Introducing mPower
By Siemens EDA - 13 Oct, 2021 - Comments: 0

Power integrity analysis evaluates circuits to determine if they will provide their designed/intended performance and reliability as implemented. Designers must be able to verify analog and digital power integrity from the RTL/gate-level through die-level integrations up to the package and board system-level. The mPower toolset is an innovative power integrity verification solution that brings ... » read more

The Everything New Syndrome
By Ed Sperling - 12 Oct, 2021 - Comments: 0

Technology is all about the latest features, the fastest processing, with the lowest power. While that sounds great in marketing pitch, any or all of those factors don't necessarily equate to a better product or long-term user satisfaction. There's a reason semiconductor companies are conservative by nature. They want to know that when they spend tens or hundreds of millions of dollars on a ... » read more

Making Batteries Denser And Safer
By Ann Mutschler - 07 Oct, 2021 - Comments: 0

Battery technology is improving swiftly, driven by the rapidly rising demand for electric vehicles and the vast body of knowledge developed by the semiconductor industry. The market for electric vehicles (EVs) is on a fast upward trajectory, with global sales predicted to grow more than 12 times to more than 31 million vehicles. In fact, EVs will account for almost a third of new vehicle sal... » read more

The Importance Of Aging Simulation In IC Design
By Andre Lange - 09 Sep, 2021 - Comments: 0

Electronics reliability has been an important quality criterion in the automotive sector and in industrial automation for years. Electronics in this sector have to achieve product lifetimes of 10+ years under partially harsh environmental conditions. But the reliability of electronics is also becoming more important in other fields. For example, end customers now keep consumer products longer, ... » read more

Inner Spacer Engineering to Improve Mechanical Stability in Channel-Release Process of Nanosheet FETs
By Technical Paper Link - 28 Aug, 2021 - Comments: 0

  Abstract "Mechanical stress is demonstrated in the fabrication process of nanosheet FETs. In particular, unwanted mechanical instability stemming from gravity during channel-release is covered in detail by aid of 3-D simulations. The simulation results show the physical weakness of suspended nanosheets and the impact of nanosheet thickness. Inner spacer engineering based on geometr... » read more

Time To Rethink Memory Chip Design And Verification
By Anand Thiruvengadam - 12 Aug, 2021 - Comments: 1

It’s no secret to anyone that semiconductor development grows more challenging all the time. Each new process technology node packs more transistors into each die, creating more electrical issues and making heat dissipation harder. Floorplanning, logic synthesis, place and route, timing analysis, electrical analysis, and functional verification stretch electronic design automation (EDA) tools... » read more

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