tag: Renesas

Designing Vehicles Virtually
By John Koon - 07 Sep, 2023 - Comments: 0

The shift toward software-defined vehicles (SDVs), electric vehicles (EVs), and ultimately autonomous vehicles (AVs) is proving the value and exposing the weaknesses in simulating individual components and complete vehicles. The ability to model this intensely complex maze of real-world interactions and possible scenarios is improving, and it's happening faster than comparable road-testing o... » read more

Radar Transceivers: How To Connect The Antennas
By Marta Martinez Vazquez - 07 Sep, 2023 - Comments: 0

There are different antenna options for transmitting and receiving a radar signal. This blog will focus on how to connect a monolithic microwave integrated circuit (MMIC) radar transceiver to the antennas in a way that guarantees an efficient transfer of the signals. mmWave MMIC to antenna interfaces At millimeter-wave (mmWave) frequencies, any transitions between two different transmission l... » read more

Cyberon Speech Recognition Technology – Light Bulb
By Renesas - 06 Sep, 2023 - Comments: 0

The purpose of a design journey is to show, in a demonstrative way, how to incorporate the technology into a design. The base designs are by definition very simple to highlight the new technology and how it can be incorporated easily. Distinct lines are drawn between the application and the technology so the reader can more generalize how to incorporate it in their own design. Introduction ... » read more

Blog Review: September 6
By Jesse Allen - 06 Sep, 2023 - Comments: 0

Cadence's Reela Samuel listens in as industry experts discuss whether generative AI-powered tools could facilitate the creation of diverse chip types and address talent shortages by creating  a more accessible entry point for those interested in circuit, chip, or system design. Synopsys' Ian Land, Jigesh Patel, and Kenneth Larsen find that the way that today’s government, aerospace, and d... » read more

Blog Review: August 30
By Jesse Allen - 30 Aug, 2023 - Comments: 0

Siemens' Dan Yu examines hallucinations in large language models, the Universal Approximation Theorem, and the role they play in applying LLMs to EDA. Cadence's Mamta Rana introduces shared flow control in PCIe 6.0, which enables the reduced cost implementation of multiple virtual channels by allowing common sets of resources to be shared. Synopsys' Arturo Salz and Johannes Stahl note tha... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 25 Aug, 2023 - Comments: 0

Intel aims to quadruple capacity for its most advanced chip packaging services by 2025, including with a new facility in Malaysia, per Nikkei Asia. Huawei is building a collection of secret semiconductor fabrication facilities across China to let the company skirt U.S. sanctions, SIA warned in a presentation seen by Bloomberg. It’s acquired at least two existing plants and is building at l... » read more

Blog Review: Aug. 23
By Jesse Allen - 23 Aug, 2023 - Comments: 0

Siemens' Stephen Chavez discusses best practices when it comes to thermal analysis for PCB design, including component placement and close collaboration between mechanical and electrical engineering disciplines. Synopsys' Gary Ruggles, Richard Solomon, and Varun Agrawal introduce the Compute Express Link (CXL) specification and how it could help improve latency through computational offloadi... » read more

Power Semis Usher In The Silicon Carbide Era
By Laura Peters - 21 Aug, 2023 - Comments: 1

Silicon carbide production is ramping quickly, driven by end market demand in automotive and price parity with silicon. Many thousands of power semiconductor modules already are in use in electric vehicles for on-board charging, traction inversion, and DC-to-DC conversion. Today, most of those are fabricated using silicon-based IGBTs. A shift to silicon carbide-based MOSFETs doubles the powe... » read more

Blog Review: Aug. 16
By Jesse Allen - 16 Aug, 2023 - Comments: 0

Synopsys' Johannes Stahl and Tim Kogel suggest that multi-die systems require a new approach at the architecture planning phase and why chip designers can’t ignore physical effects such as layout, power, temperature, or IR-drop. Siemens' Rich Edelman argues for using the waveform window in a GUI rather than $display when debugging UVM. Cadence's Paul Scannell stresses the need for diver... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 11 Aug, 2023 - Comments: 0

Intel issued an advisory of a potential security vulnerability in some of its processors. The company recommends updating to the latest firmware version. NVIDIA unveiled its GH200 Grace Hopper platform, based on 144 Arm Neoverse cores and 282GB of HBM3e memory. Meanwhile, Chinese internet companies including Baidu, ByteDance, Tencent, and Alibaba ordered about $5 billion worth of A800 proces... » read more

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