tag: RF

A New Approach For IC Test
By NI - 22 Jun, 2016 - Comments: 0

Since its inception, a founding principle of the semiconductor industry has been to continually improve performance while driving down cost. In other words, offer more for the money. However, amid greater device complexity, shorter product cycles, and relentless cost pressure, the test portion represents an increasing percentage of the total IC cost and a significant part of the product develop... » read more

Bulk CMOS Vs. FD-SOI
By Mark LaPedus - 19 May, 2016 - Comments: 2

The leading edge of the chip market increasingly is divided over whether to move to finFETs or whether to stay at 28nm using different materials and potentially even advanced packaging. Decisions about which approach to take frequently boil down to performance, power, form factor, cost, and the maturity of the individual technologies. All of those can vary by market, by vendor and by process... » read more

Pattern Matching in Design and Verification
By Michael White - 19 May, 2016 - Comments: 0

Pattern matching (PM) was first introduced as the semiconductor industry began to shift from simple one-dimensional rule checks to the two-dimensional checks required by sub-resolution lithography. These rule checks proved far more complex to write, hard to code for fast runtimes, and difficult to debug. Incorporating an automated visual capture and compare process enabled designers to define t... » read more

What’s The Outlook For ICs?
By Mark LaPedus - 19 May, 2016 - Comments: 1

As the semiconductor industry heads into the second half of 2016, it’s time to take the pulse of the IC sector. Based on the current signs, there’s a faint pulse, if that. Simply put, the IC market has been in the doldrums in the first half of 2016. And it looks sluggish heading into the second half. It wasn’t supposed to be like this. At the beginning of this year, many predicte... » read more

Foundries Expand Their Scope
By Ed Sperling - 21 Apr, 2016 - Comments: 0

By Ed Sperling & Mark LaPedus Major foundries are stepping up their offerings across a wide swath of technology nodes, specialty processes and advanced packaging—a recognition that end markets are fragmenting and that the path forward includes a mix of new and established processes. As the smart phone market flattens, there is no single "next big thing" to drive volume at the most ... » read more

Inside Mesh Networks
By Ernest Worthman - 11 Nov, 2015 - Comments: 0

Ad-hoc wireless mesh networks will be the great enabler for the IoE. Part one discusses the technology behind them. Mesh networks have a huge upside when it comes to the Internet of Everything, but there are also some big issues that have to be resolved. “One of the real challenges with mesh networks is there is not a lot of control of the devices that are joining and leaving the networ... » read more

Inside Mesh Networks
By Ernest Worthman - 05 Nov, 2015 - Comments: 0

Mesh networks could revolutionize communications in the future. Independent of the Internet we know today, wireless mesh networks (WMN) allow both ad-hoc and fixed wireless “nodes” to form a communications net that can become a very powerful information sharing hub. The idea is that all devices, both user-controlled and autonomous, would be open to act as relay points for the transmissio... » read more

Emerging IoT Applications Require Careful Consideration
By Charlie Cheng - 05 Nov, 2015 - Comments: 1

The Internet of Things (IoT) is creating opportunities in the existing space held by traditional semiconductor applications, typically falling into categories that include industrial, fitness, health and lifestyle to apparel, safety and productivity. But there also are new, inventive devices. In the last several months, we’ve seen the launch of a canine Fitbit, a hybrid dog collar, and dyn... » read more

Full-Circuit ADC Verification With Analog FastSPICE
By Mentor, a Siemens Business - 14 Oct, 2015 - Comments: 0

Analog to Digital Converters (ADCs) are critical components in high-speed, high-resolution applications where an analog or RF signal has to be processed, stored, or transported in digital form. ADC performance requirements vary by application and include resolution, dynamic range, linearity, power consumption, speed, bandwidth, SNDR (Signal-to-Noise and Distortion Ratio), and ENOB (Effective Nu... » read more

A Primer For The 802.XX Physical Layer
By Ernest Worthman - 07 Oct, 2015 - Comments: 0

This is the second installment of the 802.XX for the IoE series of articles. The first one was published in the August issue and addressed the Media Access Control (MAC) layer. In this article, we will examine the elements of the physical (PHY) layer of the 802.11 protocol stack. For reference, the protocol stack is shown in figure 1. The best designs, like everything else, are built on a so... » read more

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