tag: RF

Wafer-Level Fan-Out For High-Performance, Low-Cost Packaging Of Monolithic RF MEMS/CMOS
By Amkor - 18 Aug, 2021 - Comments: 0

Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of micro-electromechanical systems (MEMS), either monolithic or heterogeneous, introduces yet another level of complexity that has only recently been a major focus of multi-device packaging [1]. Wafer-level fanou... » read more

Electrically connected spin-torque oscillators array for 2.4 GHz WiFi band transmission and energy harvesting
By Technical Paper Link - 27 Jul, 2021 - Comments: 0

Researchers at the National University of Singapore and Tohoku University developed a device that uses spin-torque oscillators (STOs) to harvest energy from 2.4GHz Wi-Fi signals and wirelessly power an LED without need for a battery.   Technical Paper Link: Abstract "The mutual synchronization of spin-torque oscillators (STOs) is critical for communication, energy harvesting ... » read more

Manufacturing Bits: June 15
By Mark LaPedus - 15 Jun, 2021 - Comments: 0

Next-gen RF signal processors Sandia National Laboratories has taken steps to realize the development of acoustic wave amplifiers, a technology that could one day pave the way towards long-awaited tiny RF signal processors. Researchers have developed piezoelectric acoustic devices using surface acoustic wave (SAW) technology and demonstrated the ability to manufacture these devices. Still i... » read more

Hybrid System-Level Test For RF SiP
By Koji Miyauchi - 08 Jun, 2021 - Comments: 0

In recent years, the proliferation of the IoT has focused attention on low-power-wireless applications. IoT modules incorporating functions such as Bluetooth Low Energy (BLE) transceivers, MCUs, and power-management circuitry are becoming system-in-package (SiP) and even one-chip devices. Such devices increase the demand for a mass-production test environment that can measure them in a short ti... » read more

Virtuoso ADE Assembler
By Cadence - 26 May, 2021 - Comments: 0

Cadence Virtuoso ADE Assembler is an advanced design and simulation environment that extends the capabilities of Virtuoso ADE Explorer, adding all the tests needed to fully verify a design over all operational, process, and environmental conditions. As more analysis is required, users can take incremental advantage of the Virtuoso Variation Option to do more advanced statistical analysis on the... » read more

Foundry Wars Begin
By Mark LaPedus - 19 Apr, 2021 - Comments: 3

Leading-edge foundry vendors are gearing up for a new, high-stakes spending and technology race, setting the stage for a possible shakeup across the semiconductor manufacturing landscape. In March, Intel re-entered the foundry business, positioning itself against Samsung and TSMC at the leading edge, and against a multitude of foundries working at older nodes. Intel announced plans to build ... » read more

Advantages Of Picosecond Ultrasonic Technology For Advanced RF Metrology
By Onto Innovation - 06 Apr, 2021 - Comments: 0

This paper is from China Semiconductor Technology International Conference (CSTIC). Picosecond Ultrasonics (PULSE Technology) has been widely adopted as the tool-of-record for metal film thickness metrology in semiconductor fabs around the world. It provides unique advantages, such as being a rapid, non-contact, non-destructive technology, and has capabilities for simultaneous multiple layer... » read more

Meeting The Challenges Of 5G RF Production Test Services
By Vineet Pancholi - 18 Mar, 2021 - Comments: 0

Implementation of the 5G radio frequency (RF) standard is increasing rapidly [1]. Over the past four to six quarters, there has been an increased focus on publications and products that have been introduced to the marketplace. Some of the more popular RF eco-system applications include cellphone, Wi-Fi, automotive, Internet of Things (IoT), location services, and more. Wi-Fi and cellphone servi... » read more

Packaging Demands For RF And Microwave Devices
By Ken Molitor - 18 Feb, 2021 - Comments: 1

RF and microwave integrated circuits (ICs), monolithic microwave ICs (MMICs) and systems in package (SiPs) are vital for a wide range of applications. These include mobile phones, wireless local-area networks (WLANs), ultra-wideband (UWB), internet-of-things (IoT), GPS and Bluetooth devices. Moreover, RF-optimized packaging products and processes are essential to enabling the 5G ramp-up. RFI... » read more

WLFO For High-Performance Low-Cost Packaging Of RFMEMS-CMOS
By Amkor - 17 Feb, 2021 - Comments: 0

Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of micro-electromechanical systems (MEMS), either monolithic or heterogeneous, introduces yet another level of complexity that has only recently been a major focus of multi-device packaging. Wafer-level fanout (W... » read more

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