Chip Industry Technical Paper Roundup: Nov. 26


New technical papers recently added to Semiconductor Engineering’s library: [table id=494 /] Find more semiconductor research papers here. » read more

A Decade Of Architectural RowHammer Defense Solutions (Meta, SNU, UIUC)


A new technical paper titled "SoK: Systematizing a Decade of Architectural RowHammer Defenses Through the Lens of Streaming Algorithms" was published by researchers at Meta, Seoul National University and University of Illinois at Urbana-Champaign. Abstract: "A decade after its academic introduction, RowHammer (RH) remains a moving target that continues to challenge both the industry and aca... » read more

Chip Industry Week in Review


Samsung reportedly is hiking memory chip prices by 30% to 60% due to high demand from AI data centers and constrained supplies. Those shortages are causing ripples elsewhere. SMIC, China's largest foundry, said its customers are holding back orders for other types of semiconductor due to concerns about memory supplies. Meanwhile, interest in photonics and power semiconductors is picking up, ... » read more

Chip Industry Technical Paper Roundup: Oct. 28


New technical papers recently added to Semiconductor Engineering’s library: [table id=486 /] Find more semiconductor research papers here. » read more

Modulation of the Inner Gate Length in MFMIS NSFETs To Achieve Big Gains in Memory Window (Samsung, Seoul National Univ.)


A new technical paper titled "Inner Gate Length Modulation of MFMIS Nanosheet FET Memory for Advanced Technology Nodes" was published by researchers at Samsung and Seoul National University. Abstract "This work proposes a new way of lowering the area ratio (AR) between the ferroelectric and metal-oxide-semiconductor (MOS) regions of metal-ferroelectric-metal-insulator-semiconductor (MFMIS) ... » read more

Research Bits: Oct. 21


Direct patterning with UV cross-linking Researchers from Ulsan National Institute of Science and Technology (UNIST), Yonsei University, Sungkyunkwan University, University of Chemistry and Technology Prague, and Sogang University developed a technique that enables the direct patterning of 2D semiconductor materials onto substrates without the use of toxic solvents. The process involves disp... » read more

Research Bits: July 7


3D NAND PUF Researchers from Seoul National University developed a new hardware security technology based on commercially available 3D NAND flash memory. The approach is an adaptation of physical unclonable functions (PUFs) with the ability to hide a security key under user data when not in use and reveal it only when needed. The same memory space used for storing security keys can be repurpos... » read more

Chip Industry Week in Review


[Editor's Note: Early edition due to the U.S. July 4th holiday.] The U.S. government lifted export restrictions that barred Synopsys, Siemens EDA, and Cadence from selling EDA tools to China. In a statement, Synopsys said it received a letter from the U.S. Commerce Department immediately rescinding those restrictions. Siemens issued a similar statement. Which tools or hardware accelerated t... » read more

Chip Industry Technical Paper Roundup: June 9


New technical papers recently added to Semiconductor Engineering’s library: [table id=438 /] Find more semiconductor research papers here. » read more

V-NAND PUFs (Seoul National University, SK hynix)


A new technical paper titled "Concealable physical unclonable functions using vertical NAND flash memory" was published by researchers at Seoul National University and SK hynix. The paper proposes "a concealable PUF using V-NAND flash memory by generating PUF data through weak Gate-Induced-Drain-Leakage (GIDL) erase." Find the technical paper here. June 2025. Park, SH., Koo, RH., Yang,... » read more

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