Unsolved Issues In Next-Gen Photomasks

By Mark LaPedus - 17 Feb, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss optical and EUV photomasks issues, as well as the challenges facing the mask business, with Naoya Hayashi, research fellow at DNP; Peter Buck, director of MPC & mask defect management at Siemens Digital Industries Software; Bryan Kasprowicz, senior director of technical strategy at Hoya; and Aki Fujimura, CEO of D2S. What f... » read more

CFD Playing Increasing Role In Design

By Ann Mutschler - 10 Feb, 2022 - Comments: 0

With thermal issues and constraints increasing becoming integral concerns of electronics design, computational fluid dynamics technology is gaining traction as a way to model, analyze, predict, and ideally prevent thermal problems from materializing. From cooling a board to cooling a chip with a fan and heat sinks, all of this relies on air flow for the cooling, or the flow of liquid in some... » read more

Unknowns Driving Up The Cost Of Auto IC Reliability

By Ed Sperling - 08 Feb, 2022 - Comments: 2

Automotive chipmakers are considering a variety of options to improve the reliability of ICs used for everything from sensors to artificial intelligence. But collectively they could boost the number of process steps, increase the time spent in manufacturing and packaging, and stir up concerns about the amount of data that needs to be collected, shared, and stored. Accounting for advanced pro... » read more

Week In Review: Design, Low Power

By Jesse Allen - 28 Jan, 2022 - Comments: 0

Kalray, a provider of programmable data processing and storage acceleration cards for data centers, will acquire Arcapix Holdings, which provides software-defined storage and data management solutions for data-intensive applications. "I am delighted at the prospect of this acquisition that will accelerate our go-to-market and strengthen our key position in the data-intensive storage market. It ... » read more

Photomask Challenges At 3nm And Beyond

By Mark LaPedus - 25 Jan, 2022 - Comments: 1

Week In Review: Design, Low Power

By Jesse Allen - 21 Jan, 2022 - Comments: 0

Tools & design EDA industry revenue increased 7.1% year-over-year from $2.95 billion to $3.46 billion in Q3 2021, according to the ESD Alliance. "Geographically, all regions reported double-digit growth, with product categories CAE, Printed Circuit Board and Multi-Chip Module, SIP, and Services also showing double-digit growth," said Walden C. Rhines, Executive Sponsor of the SEMI Electron... » read more

Week In Review: Design, Low Power

By Jesse Allen - 14 Jan, 2022 - Comments: 0

Nvidia again made its case for acquiring Arm to the UK's Competition and Markets Authority (CMA). “Arm is a private for-profit business at a crossroads. After acquiring Arm several years ago, SoftBank increased Arm’s headcount, hoping to spur long-term growth in several markets, including data center and personal computer, long dominated by Intel and x86. SoftBank’s investment phase has c... » read more

Week In Review: Design, Low Power

By Jesse Allen - 17 Dec, 2021 - Comments: 0

Memory CEA-Leti demonstrated 16-kbit ferroelectric random-access memory (FeRAM) arrays at the 130nm node. It utilizes back-end-of-line (BEOL) integration of TiN/HfO2:Si/TiN ferroelectric capacitors as small as 0.16 µm² and solder reflow compatibility for the first time for this type of memory. The researchers anticipate it will be useful for embedded applications such at IoT and wearable dev... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 17 Dec, 2021 - Comments: 0

Automotive Features of Toyota’s key fobs for entering vehicles get turned off when drivers do not start paying a subscription fee when the complementary subscriptions end, says an article in Ars Technica. SiLC Technologies announced its compact Eyeonic Vision Sensor, a FMCW lidar sensor, is now commercially available. The sensor has a silicon photonic chip that keeps a lidar’s size down... » read more

Business, Technology Challenges Increase For Photomasks

By Mark LaPedus - 16 Dec, 2021 - Comments: 0

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tag: Siemens Digital Industries Software

Unsolved Issues In Next-Gen Photomasks

CFD Playing Increasing Role In Design

Unknowns Driving Up The Cost Of Auto IC Reliability

Week In Review: Design, Low Power

Photomask Challenges At 3nm And Beyond

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

Business, Technology Challenges Increase For Photomasks

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