tag: Siemens

Multi-Mode Clock Domain Crossing Verification Enables Analysis Efficiency And Accuracy
By Mentor, a Siemens Business - 29 Jul, 2020 - Comments: 0

This paper shows how automated modal CDC analysis is used to exhaustively verify CDC issues in all test and operational modes of an SoC with multiple IPs. This new approach automatically consolidates all results from each mode, making issues very easy to interpret and debug. What took days and weeks with the prior manual approach now takes only a few hours. To read more, click here. » read more

Blog Review: July 29
By Jesse Allen - 29 Jul, 2020 - Comments: 0

Rambus' Scott Best digs into low-cost attacks against security chips that are often used to gauge how resistant and well-designed they are and defensive countermeasures that can be taken. Mentor's Colin Walls urges embedded developers to put a priority on writing clear, maintainable code and considers when using a higher level language like C++ may be helpful. Synopsys' Scott Knowlton fin... » read more

Challenges For A Post-Moore’s Law World
By Ed Sperling - 27 Jul, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss challenges at the edge, the impact of open-source, and how to attract new talent, with Simon Segars, CEO of Arm; Joseph Sawicki, executive vice president of IC EDA at Mentor, a Siemens Business; Raik Brinkmann, CEO of OneSpin Solutions; Babak Taheri, CEO of Silvaco; John Kibarian, CEO of PDF Solutions; and Prakash Narain, CEO of Real Intent. The con... » read more

Week In Review: Design, Low Power
By Jesse Allen - 24 Jul, 2020 - Comments: 0

Perforce Software acquired Methodics. Founded in 2006 and based in San Francisco, Methodics' IP lifecycle management and traceability software will join Perforce's larger portfolio of DevOps software that includes version control, Agile planning, and static code analysis. The two companies have had a strategic partnership in place with customers using software from both companies. Terms of the ... » read more

EDA On Board With New Package Options
By Ann Mutschler - 22 Jul, 2020 - Comments: 2

A groundswell of activity around multi-die integration and advanced packaging is pushing EDA companies to develop integration strategies that speed up time to sign-off, increase confidence that a design will work as expected, while still leaving enough room for highly customized solutions. Challenges range from how to architect a design, how to explore the best options and configurations, ho... » read more

EDA Strong, M&A Activity Up
By Ed Sperling - 20 Jul, 2020 - Comments: 3

The EDA industry is faring well in an era of COVID-19 and global uncertainty, and the numbers prove it. But the question being asked privately by a number of executives across the industry is whether growth will hold up beyond the first quarter of next year if a vaccine or treatment isn't ready. There are a lot of financial models based upon a variety of developments, and so far there is lit... » read more

Week In Review: Design, Low Power
By Jesse Allen - 17 Jul, 2020 - Comments: 0

Siemens will acquire Avatar Integrated Systems. The company's place-and-route tools, which will become part of Mentor's Xcelerator portfolio, include a netlist-to-GDS full-function block-level physical implementation tool and a complete top-level prototyping, floor-planning and chip assembly tool. Based in Santa Clara, CA, Avatar was formed in 2017 from the acquired assets of ATopTech. ATopTech... » read more

Blog Review: July 15
By Jesse Allen - 15 Jul, 2020 - Comments: 0

Synopsys' Mike Borza explains DARPA's Automatic Implementation of Secure Silicon (AISS) program and why prioritizing security in the chip development and manufacturing process is so important. Mentor's Jacob Wiltgen checks out how accurate early cycle safety analysis, aided by automation, can help avoid the problem of unmet safety goals and expensive later cycle iterations. Cadence's Paul... » read more

Easier Low Power ICs With Reference Flows
By Terence Chen - 09 Jul, 2020 - Comments: 0

By Terence Chen and Alexander Volkov Power-sensitive ICs for wearables and internet of things (IoT) products are in demand for markets ranging from automotive to military/aerospace to consumer. As with most ICs, cost and time-to-market pressures are important determiners of success. Reducing risk by using a vendor-created reference flow can confer a serious business advantage. Reference f... » read more

Moving Data And Computing Closer Together
By Bryon Moyer - 09 Jul, 2020 - Comments: 2

The speed of processors has increased to the point where they often are no longer the performance bottleneck for many systems. It's now about data access. Moving data around costs both time and power, and developers are looking for ways to reduce the distances that data has to move. That means bringing data and memory nearer to each other. “Hard drives didn't have enough data flow to cr... » read more

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