Ready For 3D-IC

By Various Writers - 28 Feb, 2013 - Comments: 0

This technical presentation describes the challenges and Mentor's solutions for verifying and testing IC designs targeted for 3D packages, such as stacked die using TSVs or multi-die packages using silicon interposers. To download this white paper, click here. » read more

Inflection Points And Changes Ahead

By Ed Sperling - 23 Feb, 2013 - Comments: 0

It’s hard to justify throwing away a well-oiled machine and replacing it with a new one. It works, it’s predictable and it’s low risk. And nowhere is this more evident than in the semiconductor industry. The doubling of transistors every two years for nearly five decades has created a $300 billion chip industry, reduced the price of processing by orders of magnitude, and made possible ele... » read more

Sprint To The Finish Line

By Ed Sperling - 14 Feb, 2013 - Comments: 0

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss future challenges, pain points, and how the supply chain is being reconfigured with Chi-Ping Hsu, senior vice president for R&D in the Silicon Realization Group at Cadence. What follows are excerpts of that conversation. LPHP: Has the move to 20nm processes with 14nm finFETs progressed as smoothly as everyone hop... » read more

Stacked Die From A Networking Angle

By Mark LaPedus - 24 Jan, 2013 - Comments: 1

By Mark LaPedus The first wave of 2.5D chips using silicon interposers are trickling out in the marketplace.FPGA vendor Xilinx was the first chipmaker to ship a 2.5D device, and Altera, Cisco, Huawei and IBM recently have talked about their respective 2.5D chip developments. Generally, Altera and Xilinx have taken a somewhat identical and straightforward approach. The two companies are sepa... » read more

Fixing The Supply Chain

By Ed Sperling - 24 Jan, 2013 - Comments: 0

For all the promise and subsequent anxiety about moving to the next process node or stacking die, the real problem isn’t technology. It isn’t even cost per transistor. It’s who will take responsibility when something goes wrong. Notice the word “when” rather than “if.” Rising complexity means that chips no longer can be fully verified, so errors are a given. Some errors are wor... » read more

3 Ways To Differentiate

By Ed Sperling - 13 Jan, 2013 - Comments: 0

Time-to-market pressures and complexity have put the squeeze on design teams. They have to bring incredibly complex SoCs to market on time, make sure they’re functionally correct and work within a tight power budget, and they have to come in on or under budget. Amazingly, they’re still able to accomplish this, thanks to some heroic efforts on the part of engineers and some incredible adv... » read more

Experts At The Table: SoC Verification

By Ed Sperling - 19 Dec, 2012 - Comments: 0

By Ed Sperling System-Level Design sat down to discuss the challenges of verification with Frank Schirrmeister, group director for product marketing of the System Development Suite at Cadence; Charles Janac, chairman and CEO of Arteris, Venkat Iyer, CTO of Uniquify; and Adnan Hamid, CEO of Breker Verification Systems. What follows are excerpts of that discussion. SLD: Is the amount of time... » read more

Keeping Pace With Moore’s Law

By Ann Mutschler - 19 Dec, 2012 - Comments: 0

By Ann Steffora Mutschler As the number of transistors doubles with each move to a smaller manufacturing process technology, there are questions as to whether the current cadre of place and route tools will be able to keep in lock step. Have no fear, assured Saleem Haider, senior director of marketing for physical design and DFM at Synopsys. “For the increase in densities that we get with... » read more

What’s Before Stacked Die?

By Mark LaPedus - 13 Dec, 2012 - Comments: 0

By Mark LaPedus Advanced 2.5D/3D chip stacking has a number of challenges and is still a few years away from mass production. In fact, mass production may not occur until 2015 or 2016. But OEMs can ill afford to sit still and wait for 2.5D/3D technology to mature. So, until 2.5D/3D is ready for prime time, chipmakers and IC-packaging houses are under pressure to innovate and extend current ... » read more

Welcome To The ‘Probably Good Die’ Era

By Mark LaPedus - 13 Dec, 2012 - Comments: 0

By Mark LaPedus In today’s systems, consumers want more performance and bandwidth with a longer battery life. Some chip segments are keeping up with the demands. Still other areas are falling way behind the curve. Battery life is an obvious problem, but memory bandwidth is under the radar. “Initially, memory bandwidth nearly doubled every two years, but this trend has slowed over the pa... » read more

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Knowledge Centers
Entities, people and technologies explored

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3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

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