tag: Synopsys

Blog Review: June 15
By Jesse Allen - 15 Jun, 2022 - Comments: 0

Ansys' Vidyu Challa considers common primary, or single-use, battery chemistries and how they affect that many important cell properties, such as energy density, flammability and safety, available cell constructions, temperature range, and shelf life. Synopsys' Rimpy Chugh and Rohit Kumar Ohlayan discuss some of the challenges arising from static linting of code, shifting linting left in the... » read more

Audio, Visual Advances Intensify IC Design Tradeoffs
By Ann Mutschler - 13 Jun, 2022 - Comments: 0

A spike in the number of audio and visual sensors is greatly increasing design complexity in chips and systems, forcing engineers to make tradeoffs that can affect performance, power, and cost. Collectively, these sensors generate so much data that designers must consider where to process different data, how to prioritize it, and how to optimize it for specific applications. The tradeoffs in... » read more

DRAM Thermal Issues Reach Crisis Point
By Karen Heyman - 09 Jun, 2022 - Comments: 5

Within the DRAM world, thermal issues are at a crisis point. At 14nm and below, and in the most advanced packaging schemes, an entirely new metric may be needed to address the multiplier effect of how thermal density increasingly turns minor issues into major problems. A few overheated transistors may not greatly affect reliability, but the heat generated from a few billion transistors does.... » read more

IP Industry Transformation
By Brian Bailey - 09 Jun, 2022 - Comments: 0

The design IP industry is developing an assortment of new options and licensing schemes that could affect everything from how semiconductor companies collaborate to how ICs are designed, packaged, and brought to market. The IP market already has witnessed a sweeping shift from a "design once, use everywhere" approach, to an "architect once, customize everywhere" model, in which IP is highly ... » read more

Bringing RFIC Design And Verification Into The Modern Era
By Jian Yang - 09 Jun, 2022 - Comments: 0

For decades, developers of radio frequency (RF) chips and other analog/mixed-signal (AMS) integrated circuits (ICs) have used traditional techniques for design and verification. Most RFIC designers have continued to hand-craft active and passive devices, manually place and route their circuits, and rely on the bring-up lab to validate their pre-silicon SPICE simulations. It is often said that a... » read more

Co-Packaged Optics In The Data Center
By Ed Sperling - 08 Jun, 2022 - Comments: 0

Just because faster Ethernet is added to the data center doesn’t mean existing hardware can utilize it efficiently. Scott Durrant, strategic marketing manager at Synopsys, talks with Semiconductor Engineering about the rapid rollout of faster Ethernet rates, problems in moving data to the front module of the switch and how much energy is required, and what optical technology can bring to the ... » read more

How New Storage Technologies Enhance HPC Systems
By Synopsys - 08 Jun, 2022 - Comments: 0

High-performance computing (HPC) has historically been available primarily to governments, research institutions, and a few very large corporations for modeling, simulation, and forecasting applications. As HPC platforms are being deployed in the cloud for shared services, high-performance computing is becoming much more accessible, and its use is benefiting organizations of all sizes. Increasi... » read more

Removing Barriers For End-To-End Analytics
By Anne Meixner - 07 Jun, 2022 - Comments: 0

Parties are coming together, generating guidelines for sharing data from IC design and manufacturing through end of life, setting the stage for true end-to-end analytics. While the promise of big data analytics is well understood, data sharing through the semiconductor supply chain has been stymied by an inability to link together data sources throughout the lifecycle of a chip, package, or ... » read more

Enabling SoC Visibility For Future Secure Hardware Architectures With In-Chip Environmental Monitoring
By Ramsay Allen - 07 Jun, 2022 - Comments: 0

Billions of people around the world are now online and generating vast amounts of data every day. This data revolution, which is largely driven by user performance requirements, is a double-edged sword. On one hand it is enabling huge technology advancements, revolutionizing the way we connect with each other and the world around us, but on the other hand it is exposing major vulnerabilities in... » read more

Silicon Lifecycle Management: Actionable Silicon Insights Through Intelligent Measurement And Analysis
By Synopsys - 07 Jun, 2022 - Comments: 0

Semiconductors have always been challenging to develop, with many waves of innovation in electronic design automation (EDA) tools and fabrication technologies barely keeping ahead of ever-growing design size and sophistication. Once again, the industry has reached a tipping point. The combination of increasing chip and system complexity, coupled with higher expectations for product performance ... » read more

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