tag: Synopsys

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 21 Jul, 2023 - Comments: 0

TSMC is delaying construction on its $40 billion fab in Arizona due to a shortage of U.S. semiconductor workers and higher-than-expected expenses, Bloomberg reported. The Semiconductor Industry Association (SIA) urged the U.S. government to refrain from further restrictions on semiconductor technology to China “until it engages more extensively with industry and experts to assess the impac... » read more

Week In Review: Design, Low Power
By Jesse Allen - 21 Jul, 2023 - Comments: 0

Cadence will acquire Rambus' SerDes and memory interface PHY IP business. Rambus will retain its digital IP business, including memory and interface controllers and security IP. “With this transaction, we will increase our focus on market-leading digital IP and chips and expand our roadmap of novel memory solutions to support the continued evolution of the data center and AI,” said Sean Fan... » read more

Evolution Of Equalization Techniques In High-Speed SerDes For Extended Reaches
By Madhumita Sanyal - 20 Jul, 2023 - Comments: 0

The relentless demand for massive amounts of data is accelerating the pace of high-performance computing (HPC) within the high-speed Ethernet realm. This escalation, in turn, intensified the complexity associated with designing networking SoCs, including switches, NICs, retimers, and pluggable modules. Such growth is accelerating the demand for bandwidth hungry applications to transition from 4... » read more

Improving Performance And Lowering Power In Automotive
By Ann Mutschler - 20 Jul, 2023 - Comments: 0

Automotive OEMs are boosting their investments across the semiconductor ecosystem as stepping stones toward electrification and autonomy, and they are starting to encounter some of the same issues chipmakers have been wrestling with at advanced nodes — massive compute performance, thermal and power issues, reliability over extended lifetimes, and a highly diverse and geographically distribute... » read more

Getting Rid Of Heat In Chips
By Brian Bailey - 20 Jul, 2023 - Comments: 1

Power consumed by semiconductors creates heat, which must be removed from the device, but how to do this efficiently is a growing challenge. Heat is the waste product of semiconductors. It is produced when power is dissipated in devices and along wires. Power is consumed when devices switch, meaning that it is dependent upon activity, and that power is constantly being wasted by imperfect de... » read more

HBM’s Future: Necessary But Expensive
By Karen Heyman - 20 Jul, 2023 - Comments: 0

High-bandwidth memory (HBM) is becoming the memory of choice for hyperscalers, but there are still questions about its ultimate fate in the mainstream marketplace. While it’s well-established in data centers, with usage growing due to the demands of AI/ML, wider adoption is inhibited by drawbacks inherent in its basic design. On the one hand, HBM offers a compact 2.5D form factor that enables... » read more

Blog Review: July 19
By Jesse Allen - 19 Jul, 2023 - Comments: 0

Siemens' Keith Felton argues that co-design-driven semiconductor package planning and prototyping is critical for design success and points to how interchange formats enable designers to make trade-off decisions for both the package and the board and communicate those recommendations back to the other design team in formats that are native to their tools. Cadence's Xin Mu explains precoding ... » read more

RTL Restructuring Issues
By Ed Sperling - 18 Jul, 2023 - Comments: 0

Modification of modules in RTL is the last place in chip design where changes can be made relatively easily before they reach physical design, but it’s still as complicated as the design itself — and it becomes more difficult in 3D-ICs. Jim Schultz, product marketing manager for digital design implementation at Synopsys, talks about grouping and ungrouping, re-parenting, and breaking connec... » read more

Wi-Fi 7 Moves Forward, Adding Yet Another Protocol
By Karen Heyman - 17 Jul, 2023 - Comments: 1

The latest generation Wi-Fi protocol brings better speeds and data handling, but it does little to bridge various communications technologies. That, in turn, makes it more difficult and more expensive to design chips because they must integrate and support multiple wireless technologies, including different versions of the same technology. Wireless communications technologies are often victi... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 14 Jul, 2023 - Comments: 0

SEMICON West returned in force this week, with a focus on AI and deep learning  in semiconductor manufacturing, security, heterogenous ICs, and the march toward a $1 trillion chip market. Lam Research President and CEO, Tim Archer, opened with the keynote presentation. Fig. 1: SEMICON West panel: AI’s influence on growth, China-U.S. trade war, and the importance of climate policy were... » read more

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