tag: Technical University of Munich

Chip Industry’s Technical Paper Roundup: October 3
By Liz Allan - 03 Oct, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=150 /] Related Reading Technical Paper Library home » read more

SRAM-Based IMC For Cryogenic CMOS Using Commercial 5 nm FinFETs
By Technical Paper Link - 27 Sep, 2023 - Comments: 0

A technical paper titled “Cryogenic In-Memory Computing for Quantum Processors Using Commercial 5-nm FinFETs” was published by researchers at University of Stuttgart, Indian Institute of Technology Kanpur, University of California Berkeley, and Technical University of Munich. Abstract: "Cryogenic CMOS circuits that efficiently connect the classical domain with the quantum world are the co... » read more

The Race Toward Quantum Advantage
By Brian Bailey - 14 Sep, 2023 - Comments: 0

Quantum computing has yet to show an advantage over conventional computing, but huge sums of money are betting it will. So far that hasn't happened. Early quantum computers were created in the mid-1990s after mathematicians had demonstrated the effectiveness of applying quantum approaches to some problems. At that stage they were simulated using conventional computing, but it started the rac... » read more

Quantum Research Bits: Sept. 12
By Ed Sperling - 12 Sep, 2022 - Comments: 1

Making Qubits Last Longer One of the big challenges in quantum computing is extending the lifespan of qubits, called coherence time, long enough to do something useful with them. Research is now focused on how to increase that usable lifetime, and what factors can impact that. This has led to very different conclusions about whether silicon is a good substrate choice for quantum chips. Rese... » read more

Research Bits: Aug. 30
By Jesse Allen - 30 Aug, 2022 - Comments: 0

Through glass vias Researchers from the Chinese Academy of Sciences (CAS) developed a Through Glass Via (TGV) process for 3D advanced packaging, which they say enables low transmission loss and high vacuum wafer-level packaging of high-frequency chips and MEMS sensors. TGV is a vertical interconnection technology applied in wafer-level vacuum packaging. The researchers found that it has goo... » read more

Technical Paper Roundup: Aug. 30
By Linda Christensen - 30 Aug, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=47 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Training a Quantum Neural Network Requires Only A Small Amount of Data
By Technical Paper Link - 24 Aug, 2022 - Comments: 0

A new research paper titled "Generalization in quantum machine learning from few training data" was published by researchers at Technical University of Munich, Munich Center for Quantum Science and Technology (MCQST), Caltech, and Los Alamos National Lab. “Many people believe that quantum machine learning will require a lot of data. We have rigorously shown that for many relevant problems,... » read more

Technical Paper Round-Up: March 22
By Linda Christensen - 22 Mar, 2022 - Comments: 0

New memories, materials, and transistor types, and processes for making those devices, highlighted the past week's technical papers. That includes everything from vertical MoS2 to programmable black phosphorus image sensors and photonic lift-off processes for flexible thin-film materials. Papers continue to flow from all parts of the supply chain, with some new studies out of Pakistan, Seoul... » read more

E/E Architecture Synthesis: Challenges and Technologies
By Technical Paper Link - 19 Mar, 2022 - Comments: 0

ACADEMIC PAPER Abstract "In recent years, the electrical and/or electronic architecture of vehicles has been significantly evolving. The new generation of cars demands a considerable amount of computational power due to a large number of safety-critical applications and driver-assisted functionalities. Consequently, a high-performance computing unit is required to provide the demanded pow... » read more

Week In Review: Design, Low Power
By Jesse Allen - 11 Mar, 2022 - Comments: 0

Intellectual Property Flex Logix inked an agreement with the Air Force Research Laboratory, Sensors Directorate (AFRL/RY) covering any Flex Logix IP technology for use in all US Government-funded programs for research and prototyping purposes with no license fees. “Our first license with AFRL for EFLX eFPGA in GlobalFoundries 12nm process was highly successful, with more than a half dozen pr... » read more

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