The Upside Of Through-Silicon Vias

By Katherine Derbyshire - 17 Oct, 2013 - Comments: 0

Through-silicon vias (TSVs) for 3D integration are superficially similar to damascene copper interconnects for integrated circuits. Both etch the via, into either silicon or a dielectric, line it with a barrier against copper diffusion, then deposit a seed layer prior to filling the via with copper using some form of aqueous deposition. In both processes, the integrity of the diffusion barrier ... » read more

Bigger Pipes, New Priorities

By Ed Sperling - 28 Jul, 2011 - Comments: 0

By Ann Steffora Mutschler From the impact of stacking on memory subsystems to advances in computing architecture, Micron Technology is at the forefront in the memory industry. System-Level Design sat down to discuss challenges, as well as some possible solutions, that plague memory subsystem architects with Scott Graham, general manager for Micron’s Hybrid Memory Cube (HMC) and Joe Jeddeloh,... » read more

Preparing For 3D IC Stacking

By Ed Sperling - 22 Jul, 2010 - Comments: 0

By David Lammers Through-silicon vias (TSVs) are in various stages of late development, but design and manufacturing challenges remain before companies can gain the full benefits of the third dimension. Two camps are pushing hard to introduce TSVs—the design community and the manufacturing equipment companies. The initial goal is to connect graphics memories to graphics processors in mobi... » read more

Stressing Over 3D

By Ed Sperling - 24 Jun, 2010 - Comments: 0

By David Lammers Pol Marchal recalls putting a stacked 3D prototype on his desk at IMEC in Leuven, Belgium, last year, which a visitor picked up and examined two months later. “I don’t think this chip will work,” the visitor said, causing Marchal, principal scientist at IMEC’s 3D system integration program, to put the stacked die under a microscope. Sure enough, Pol found that mechanic... » read more

3D Integration: Extending Moore’s Law Into The Next Decade

By Cheryl Ajluni - 27 Aug, 2009 - Comments: 0

By Cheryl Ajluni At the 46th Design Automation Conference in San Francisco last month, attention turned to a discussion of how to extend the momentum of Moore’s Law into the next decade. One plausible solution, according to Philippe Magarshack, the general manager of Central CAD & Design Solutions at STMicroelectronics, is 3D stacking for complex System-on-Chips (SoCs). The concept of 3... » read more

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tag: through-silicon vias

The Upside Of Through-Silicon Vias

Bigger Pipes, New Priorities

Preparing For 3D IC Stacking

Stressing Over 3D

3D Integration: Extending Moore’s Law Into The Next Decade

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