tag: TSMC

Next EUV Issue: Mask 3D Effects
By Mark LaPedus - 25 Apr, 2018 - Comments: 6

As extreme ultraviolet (EUV) lithography moves closer to production, the industry is paying more attention to a problematic phenomenon called mask 3D effects. Mask 3D effects involve the photomask for EUV. In simple terms, a chipmaker designs an IC, which is translated from a file format into a photomask. The mask is a master template for a given IC design. It is placed in a lithography scan... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 20 Apr, 2018 - Comments: 2

Trade The trade tensions are building between the U.S. and China. In the latest move, the U.S. Department of Commerce has imposed a ban on U.S. companies selling chips to ZTE, a Chinese telecom equipment and mobile phone vendor. The ban has been implemented on ZTE for seven years after the firm “was caught illegally shipping U.S. goods to Iran,” according to a report from Reuters. This ... » read more

Searching For EUV Defects
By Mark LaPedus - 19 Apr, 2018 - Comments: 1

Chipmakers hope to insert extreme ultraviolet (EUV) lithography at 7nm and/or 5nm, but several challenges need to be solved before this oft-delayed technology can be used in production. One lingering issue that is becoming more worrisome is how to find defects caused by [gettech id="31045" comment="EUV"] processes. These processes can cause random variations, also known as stochastic effects... » read more

The Week In Review: Design
By Jesse Allen - 13 Apr, 2018 - Comments: 0

Tools & IP Cadence unveiled its latest DSP for embedded vision and AI, Tensilica Vision Q6 DSP. The DSP is built on a 13-stage processor pipeline and new system architecture designed for use with large local memories, and achieves 1.5GHz peak frequency and 1GHz typical frequency at 16nm. Compared to its predecessor, it offers 1.5X greater vision and AI performance than its predecessor and ... » read more

Choosing The Right Interconnect
By Ed Sperling - 09 Apr, 2018 - Comments: 3

Efforts to zero in on cheaper advanced packaging approaches that can speed time to market are being sidetracked by a dizzying number of choices. At the center of this frenzy of activity is the [getkc id="36" kc_name="interconnect"]. Current options range from organic, silicon and glass interposers, to bridges that span different die at multiple levels. There also are various fan-out approach... » read more

The Week in Review: IoT
By Jeff Dorsch - 06 Apr, 2018 - Comments: 0

Investment Microsoft this week said it will spend $5 billion over four years on Internet of Things programs in research, development, and partner enablement. The company previously spent $1.5 billion on developing IoT technology. The move could pay dividends for the Microsoft Azure cloud platform and lead to wider use of Azure Stack, which pairs Microsoft software with hardware from approved p... » read more

EUV’s New Problem Areas
By Mark LaPedus - 19 Mar, 2018 - Comments: 2

Extreme ultraviolet (EUV) lithography is moving closer to production, but problematic variations—also known as stochastic effects—are resurfacing and creating more challenges for the long-overdue technology. GlobalFoundries, Intel, Samsung and TSMC hope to insert [gettech id="31045" comment="EUV"] lithography into production at 7nm and/or 5nm. But as before, EUV consists of several compo... » read more

DSA Re-Enters Litho Picture
By Mark LaPedus - 15 Mar, 2018 - Comments: 1

By Mark LaPedus and Ed Sperling Directed self-assembly (DSA) is moving back onto the patterning radar screen amid ongoing challenges in lithography. Intel continues to have a keen interest in [gettech id="31046" t_name="DSA"], while other chipmakers are taking another hard look at the technology, according to multiple industry sources. DSA isn't like a traditional [getkc id="80" kc_name="... » read more

Multiphysics Reliability Signoff For Next-Gen Auto Electronics Systems
By Annapoorna Krishnaswamy - 12 Mar, 2018 - Comments: 0

The automotive industry is in the midst of a sea change. Growing market needs for electrification, connectivity on the go, advanced driver assistance systems, and ultimately the goal of autonomous driving, are creating newer requirements and greater challenges. A chassis on four wheels is now fitted with cameras, radar and other sensors, which will be the eyes of the driverless car, as well as ... » read more

Why All Nodes Won’t Work
By Ed Sperling - 08 Mar, 2018 - Comments: 4

A flood of new nodes, half-nodes and every number in between is creating confusion among chipmakers. While most say it's good to have choices, it's not clear which or how many of those choices are actually good. At issue is which [getkc id="43" kc_name="IP"] will be available for those nodes, how that IP will differ from other nodes in terms of power, performance, area and sensitivity to a v... » read more

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