tag: U.S. Department of Commerce

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 28 Oct, 2022 - Comments: 0

Automotive, mobility Ford Motor Company revealed it lost $827 million in the third quarter because of parts shortages and unexpected supplier costs. Those shortages affected 40,000 to 50,000 vehicles. The company is shutting down its interest in its self-driving car unit Argo.ai, which it shared with Volkswagen since 2019. Ford will instead focus on advanced driver-assist systems (ADAS), which... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 07 Oct, 2022 - Comments: 0

Automotive, mobility Infineon opened a new factory in Cegléd, Hungary, for assembly and test of high-power semiconductor modules for EVs. “The new manufacturing capacities will help Infineon accommodate the growing demand for electromobility applications,” said Infineon’s COO Rutger Wijburg in a press release. Production ramp-up started in February 2022. Infineon also announced it will ... » read more

CHIPS Act: U.S. Releases New Implementation Strategy
By Linda Christensen - 06 Sep, 2022 - Comments: 1

The U.S. Department of Commerce today published "A Strategy For The CHIPS For America Fund," outlining its implementation approach to distributing $50 billion from the CHIPS Act of 2022. Find the full strategy paper here, and the executive summary here. Program Goals The program's four primary goals are: Establish and expand domestic production of leading edge semiconductors in ... » read more

Chips Can Boost Malware Immunity
By John Koon - 15 Jun, 2022 - Comments: 0

Security is becoming an increasingly important design element, fueled by increasingly sophisticated attacks, the growing use of technology in safety-critical applications, and the rising value of data nearly everywhere. Hackers can unlock automobiles, phones, and smart locks by exploiting system design soft spots. They even can hack some mobile phones through always-on circuits when they are... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Mar, 2022 - Comments: 0

Packaging ASE, AMD, Arm, Google, Intel, Meta, Microsoft, Qualcomm, Samsung, and TSMC have announced the formation of a consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem. The founding companies also ratified the UCIe specification, an open industry standard developed to establish a standard interconnect at the package level. The UCIe 1.0 s... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 01 May, 2020 - Comments: 0

Fab tools The U.S. Department of Commerce has announced new export control actions to prevent China, Russia, and Venezuela from obtaining U.S. technology for military purposes. This expands the “Military End Use/User Controls (MEU)” license requirement controls on China, Russia, and Venezuela, covering military end-users, as well as semiconductor equipment, sensors and other technologies. ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 21 Feb, 2020 - Comments: 0

Fab tools The United States is mulling over new trade export restrictions for U.S. fab equipment to China, according to a report from The Wall Street Journal. “Recent press reports suggest the U.S. Department of Commerce is exploring additional measures to limit Huawei's access to U.S. semiconductor capital equipment (SPE) by requiring chip manufacturing plants globally to procure license... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 23 Aug, 2019 - Comments: 0

AI chip boom or bust? The semiconductor industry is the most bullish about adopting artificial intelligence (AI), according to a new report from Accenture. Some 77% of semiconductor executives surveyed said they have adopted AI within their businesses or are piloting the technology. In addition, 63% of semiconductor executives expect that AI will have the greatest impact on their business over... » read more

Week in Review: IoT, Security, Autos
By Jeff Dorsch - 23 Aug, 2019 - Comments: 0

Products/Services Huawei Technologies is again delaying the public introduction of its Mate X foldable smartphone. It is unlikely the product will be marketed in the U.S., given the ongoing trade war. The official rollout now seems likely to come in November, in time for the holiday shopping season. Samsung Electronics has had its problems with foldable phones, yet those were due to manufactur... » read more

China’s Latest Goal—More DRAMs
By Mark LaPedus - 18 Jul, 2019 - Comments: 0

China is once again making a concerted effort to get its domestic DRAM industry off the ground. Past efforts have fallen short or failed. This time around, it’s unclear if China will succeed, but the industry should pay close attention here. So why would China want to play a bigger role in the tough and competitive DRAM business? For one thing, the U.S. and China are in the midst of a t... » read more

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