tag: UCLA

Reporting and Benchmarking Process For A 2D Semiconductor FET
By Technical Paper Link - 29 Jul, 2022 - Comments: 0

New research paper titled "How to Report and Benchmark Emerging Field-Effect Transistors" was published from researchers at NIST, Purdue University, UCLA, Theiss Research, Peking University, NYU, Imec, RWTH Aachen, and others. "Emerging low-dimensional nanomaterials have been studied for decades in device applications as field-effect transistors (FETs). However, properly reporting and compar... » read more

Toward Democratized IC Design And Customized Computing
By Jason Cong - 28 Jun, 2022 - Comments: 0

Integrated circuit (IC) design is often considered a “black art,” restricted to only those with advanced degrees or years of training in electrical engineering. Given that the semiconductor industry is struggling to expand its workforce, IC design must be rendered more accessible. The benefit of customized computing General-purpose computers are widely used, but their performance improv... » read more

Technical Paper Round-up: June 14
By Linda Christensen - 14 Jun, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=33 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

Simulation Framework to Evaluate the Feasibility of Large-scale DNNs based on CIM Architecture & Analog NVM
By Technical Paper Link - 10 Jun, 2022 - Comments: 0

Technical paper titled "Accuracy and Resiliency of Analog Compute-in-Memory Inference Engines" from researchers at UCLA. Abstract "Recently, analog compute-in-memory (CIM) architectures based on emerging analog non-volatile memory (NVM) technologies have been explored for deep neural networks (DNNs) to improve scalability, speed, and energy efficiency. Such architectures, however, leverage ... » read more

Technical Paper Round-up: April 26
By Linda Christensen - 26 Apr, 2022 - Comments: 0

Find all technical papers in Semiconductor Engineering’s library. [table id=23 /]   Semiconductor Engineering is in the process of building this library of research papers.  Please send suggestions for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a ... » read more

Artificial intelligence deep learning for 3D IC reliability prediction
By Technical Paper Link - 25 Apr, 2022 - Comments: 0

New research from National Yang Ming Chiao Tung University, National Center for High-Performance Computing (Taiwan), Tunghai University, MA-Tek Inc, and UCLA. Abstract "Three-dimensional integrated circuit (3D IC) technologies have been receiving much attention recently due to the near-ending of Moore’s law of minimization in 2D IC. However, the reliability of 3D IC, which is greatly infl... » read more

Technical Paper Round-Up: March 15
By Linda Christensen - 15 Mar, 2022 - Comments: 0

Research is expanding across a variety of semiconductor-related topics, from security to flexible substrates and chiplets. Unlike in the past, when work was confined to some of the largest universities, that research work is now being spread across a much broader spectrum of schools on a global basic, including joint research involving schools whose names rarely appeared together. Among the ... » read more

Designing a 2048-Chiplet, 14336-Core Waferscale Processor
By Technical Paper Link - 14 Mar, 2022 - Comments: 0

Abstract "Waferscale processor systems can provide the large number of cores, and memory bandwidth required by today’s highly parallel workloads. One approach to building waferscale systems is to use a chiplet-based architecture where pre-tested chiplets are integrated on a passive silicon-interconnect wafer. This technology allows heterogeneous integration and can provide significant perfor... » read more

Power/Performance Bits: Jan. 3
By Jesse Allen - 03 Jan, 2022 - Comments: 0

Optical device integration Researchers from the University of Strathclyde, University of Glasgow, and the Australian National University propose a way to place multiple micron-scale optical devices made from different materials close together on a single silicon chip. “The development of electronics that are based on silicon transistors has enabled increasingly more powerful and flexible ... » read more

Materials and Device Simulations for Silicon Qubit Design and Optimization
By Technical Paper Link - 27 Oct, 2021 - Comments: 0

Abstract: "Silicon-based microelectronics technology is extremely mature, yet this profoundly important material is now also poised to become a foundation for quantum information processing technologies. In this article, we review the properties of silicon that have made it the material of choice for semiconductor-based qubits with an emphasis on the role that modeling and simulation have play... » read more

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