A New Class Of Actuators Mimicking Human Muscle

By Heidi Hoffman - 15 Jun, 2023 - Comments: 0

Developing robots with human-like muscles that produce autonomous movement is not possible using traditional rigid, high-voltage electronics. However, recent research funded by FlexTech, a SEMI Technology community, shows promise in incorporating microcircuits to do just that by directly controlling and operating HASEL actuators. The innovation could guide intelligent, goal-oriented robots in ... » read more

Multi-Wavelength, Multimode Communication Scheme For On-Chip and Chip-to-Chip Interconnects

By Technical Paper Link - 02 Jan, 2023 - Comments: 0

A technical paper titled "Multi-dimensional data transmission using inverse-designed silicon photonics and microcombs" was published by researchers at Stanford, Harvard, University of Central Florida, NIST, and others. "Here we demonstrate an integrated multi-dimensional communication scheme that combines wavelength- and mode- multiplexing on a silicon photonic circuit. Using foundry-compati... » read more

Blog Review: May 5

By Jesse Allen - 05 May, 2021 - Comments: 0

Arm's William Wang considers how to increase the performance and programmability of persistent applications through using battery to protect the on-chip volatile cache hierarchy. Cadence's Paul McLellan finds that ransomware is getting more sophisticated, and more difficult to eradicate and defend against, with potentially life-threatening consequences. Synopsys' Jonathan Knudsen digs int... » read more

Manufacturing Bits: Sept. 1

By Mark LaPedus - 01 Sep, 2020 - Comments: 0

AI, quantum computing R&D centers The White House Office of Science and Technology Policy, the National Science Foundation (NSF), and the U.S. Department of Energy (DOE) have announced over $1 billion in awards for the establishment of several new artificial intelligence and quantum information science (QIS) research institutes in the U.S. Under the plan, the U.S. is launching seven new... » read more

Atomic Layer Etch Expands To New Markets

By Mark LaPedus - 16 Jul, 2020 - Comments: 0

The semiconductor industry is developing the next wave of applications for atomic layer etch (ALE), hoping to get a foothold in some new and emerging markets. ALE, a next-generation etch technology that removes materials at the atomic scale, is one of several tools used to process advanced devices in a fab. ALE moved into production for select applications around 2016, although the technolog... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 02 Jul, 2020 - Comments: 0

The American Foundries Act, a bipartisan initiative to revive U.S. leadership in the global microelectronics sector, was announced by U.S. Democratic Senator Chuck Schumer from New York. “The economic and national security risks posed by relying too heavily on foreign semiconductor suppliers cannot be ignored, and Upstate New York, which has a robust semiconductor sector, is the perfect place... » read more

Manufacturing Bits: Oct. 1

By Mark LaPedus - 01 Oct, 2019 - Comments: 0

3D balloon printing Using an elastomeric or stretchy balloon, the University of Houston and the University of Colorado have developed a new 3D printing method as a means to develop three-dimensional curvy electronic products. The technology involves the field of 3D printing, sometimes known as additive manufacturing (AM). In 3D printing, the goal is to develop parts layer-by-layer using mat... » read more

System Bits: Aug. 5

By Jeff Dorsch - 05 Aug, 2019 - Comments: 0

Algorithm could advance quantum computing Scientists at the Los Alamos National Laboratory report the development of a quantum computing algorithm that promises to provide a better understanding of the quantum-to-classical transition, enabling model systems for biological proteins and other advanced applications. “The quantum-to-classical transition occurs when you add more and more parti... » read more

What’s Next For Atomic Layer Etch?

By Mark LaPedus - 16 Nov, 2017 - Comments: 0

After years in R&D, several fab tool vendors last year finally began to ship systems based a next-generation technology called atomic layer etch (ALE). [getkc id="284" kc_name="ALE"] is is moving into 16/14nm, but it will play a big role at 10/7nm and beyond. The industry also is working on the next wave of ALE technology for advanced logic and memory production. Used by chipmakers fo... » read more

Manufacturing Bits: Oct. 18

By Mark LaPedus - 18 Oct, 2016 - Comments: 0

Measuring gooey materials The National Institute of Standards and Technology (NIST) and Thermo Fisher Scientific have devised an instrument that correlates the flow properties of “soft gooey” materials, such as gels, molten polymers and biological fluids. The instrument, called a rheo-Raman microscope, combines three instruments into one system. First, the system incorporates a Raman sp... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?