tag: University of Michigan

Nonvolatile ECRAM With A Short-Circuit Retention Time Several Orders of Magnitude Higher Than Previously Shown
By Technical Paper Link - 18 Oct, 2022 - Comments: 0

A new technical paper titled "Nonvolatile Electrochemical Random-Access Memory Under Short Circuit" was published by researchers at University of Michigan and Sandia National Laboratories. Abstract "Electrochemical random-access memory (ECRAM) is a recently developed and highly promising analog resistive memory element for in-memory computing. One longstanding challenge of ECRAM is attainin... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 23 Sep, 2022 - Comments: 0

On Sunday, a 6.8-magnitude earthquake struck the southeast region of Taiwan, causing devastation. TSMC officials reported “no known significant impact for now.” Market research firm TrendForce arrived at a similar conclusion based on its analysis of individual fabs. The Biden administration announced appointment of the leadership team charged with implementing the US CHIPS and Science Ac... » read more

Technical Paper Roundup: Aug. 30
By Linda Christensen - 30 Aug, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=47 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Finding the Scope of CXL-Enabled Tiered Memory System in Production
By Technical Paper Link - 25 Aug, 2022 - Comments: 0

This new technical paper titled "TPP: Transparent Page Placement for CXL-Enabled Tiered Memory" is presented by researchers at University of Michigan and Meta Inc. Abstract (partial) "We propose a novel OS-level application-transparent page placement mechanism (TPP) for efficient memory management. TPP employs a lightweight mechanism to identify and place hot and cold pages to appropriate... » read more

Chip Backdoors: Assessing the Threat
By Jeff Goldman - 04 Aug, 2022 - Comments: 0

In 2018, Bloomberg Businessweek made an explosive claim: Chinese spies had implanted backdoors in motherboards used by some high-profile customers, including the U.S. Department of Defense. All of those customers issued strongly worded denials. Most reports of hardware backdoors have ended up in exchanges like these. There are allegations and counter-allegations about specifics. But as hardw... » read more

Need Design Talent? Create a Contest
By Marie C. Baca - 02 Aug, 2022 - Comments: 0

Amid a labor crunch for qualified engineers, semiconductor ecosystem participants are coming up with new strategies to entice university students, such as design competitions. In one design competition sponsored by Renesas earlier this year for European university students and their educators, teams were tasked with building a self-guided robot that could drive along a track in a virtual sim... » read more

Technical Paper Round-up: May 3
By Linda Christensen - 03 May, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=24 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Power/Performance Bits: Aug. 31
By Jesse Allen - 31 Aug, 2021 - Comments: 0

Securing memory Researchers at Columbia University suggest several ways to make computing more secure without imposing a system performance penalty. The efforts focus on memory security, specifically pointers. "Memory safety has been a problem for nearly 40 years and numerous solutions have been proposed. We believe that memory safety continues to be a problem because it does not distribute... » read more

Manufacturing Bits: Aug. 3
By Mark LaPedus - 03 Aug, 2021 - Comments: 0

World’s thinnest magnet Lawrence Berkeley National Laboratory, the University of California at Berkeley and others have developed what researchers say is the world’s thinnest magnet. The one-atom-thin, two-dimensional (2D) magnet could one day pave the way towards new spin electronics or spintronics memory devices and other technologies in the market. Spintronics uses the orientation of... » read more

Blog Review: Jan. 13
By Jesse Allen - 13 Jan, 2021 - Comments: 0

Siemens EDA's Harry Foster tracks trends in IC and ASIC design and finds that increased design size is only one dimension of the growing complexity challenge. Synopsys' Chris Clark and Dennis Kengo Oka predicts how the automotive industry will change in 2021, including new standards for security, increased use of AI and V2X technologies, and a growing focus on software. Cadence's Paul McL... » read more

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