Chip Industry’s Technical Paper Roundup: Nov. 15


New technical papers added to Semiconductor Engineering’s library this week. [table id=63 /] » read more

Red MicroLEDs Three Orders of Magnitude Smaller in Surface Area


A technical paper titled "N-polar InGaN/GaN nanowires: overcoming the efficiency cliff of red-emitting micro-LEDs" was published by researchers at University of Michigan. The researchers created "red-microLEDs that are nearly three orders of magnitude smaller in surface area than previously reported devices while exhibiting external quantum efficiency of ~1.2%," according to the University o... » read more

Chip Industry’s Technical Paper Roundup: Oct 25


New technical papers added to Semiconductor Engineering’s library this week. [table id=59 /] » read more

Nonvolatile ECRAM With A Short-Circuit Retention Time Several Orders of Magnitude Higher Than Previously Shown


A new technical paper titled "Nonvolatile Electrochemical Random-Access Memory Under Short Circuit" was published by researchers at University of Michigan and Sandia National Laboratories. Abstract "Electrochemical random-access memory (ECRAM) is a recently developed and highly promising analog resistive memory element for in-memory computing. One longstanding challenge of ECRAM is attainin... » read more

Week In Review: Manufacturing, Test


On Sunday, a 6.8-magnitude earthquake struck the southeast region of Taiwan, causing devastation. TSMC officials reported “no known significant impact for now.” Market research firm TrendForce arrived at a similar conclusion based on its analysis of individual fabs. The Biden administration announced appointment of the leadership team charged with implementing the US CHIPS and Science Ac... » read more

Technical Paper Roundup: Aug. 30


New technical papers added to Semiconductor Engineering’s library this week. [table id=47 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Finding the Scope of CXL-Enabled Tiered Memory System in Production


This new technical paper titled "TPP: Transparent Page Placement for CXL-Enabled Tiered Memory" is presented by researchers at University of Michigan and Meta Inc. Abstract (partial) "We propose a novel OS-level application-transparent page placement mechanism (TPP) for efficient memory management. TPP employs a lightweight mechanism to identify and place hot and cold pages to appropriate... » read more

Chip Backdoors: Assessing the Threat


In 2018, Bloomberg Businessweek made an explosive claim: Chinese spies had implanted backdoors in motherboards used by some high-profile customers, including the U.S. Department of Defense. All of those customers issued strongly worded denials. Most reports of hardware backdoors have ended up in exchanges like these. There are allegations and counter-allegations about specifics. But as hardw... » read more

Need Design Talent? Create a Contest


Amid a labor crunch for qualified engineers, semiconductor ecosystem participants are coming up with new strategies to entice university students, such as design competitions. In one design competition sponsored by Renesas earlier this year for European university students and their educators, teams were tasked with building a self-guided robot that could drive along a track in a virtual sim... » read more

Technical Paper Round-up: May 3


New technical papers added to Semiconductor Engineering’s library this week. [table id=24 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

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