The Utility Of Shallow Dynamic Circuits For Long-Range Entanglement On Large-Scale Quantum Devices


A technical paper titled “Efficient Long-Range Entanglement using Dynamic Circuits” was published by researchers at IBM Research, IBM T.J. Watson Research Center, University of Southern California, MIT-IBM Watson AI Lab, and IBM Quantum. Abstract: "Quantum simulation traditionally relies on unitary dynamics, inherently imposing efficiency constraints on the generation of intricate entangl... » read more

Week In Review: Auto, Security, Pervasive Computing


Former Apple engineer Weibao Wang was indicted for stealing Apple’s autonomous vehicle hardware and software IP and giving the information to Chinese competitors. Among other items, authorities said they found source code for the project on the engineer’s personal laptop, which was seized at his home. Wang fled to China the same day a search warrant was executed. This is one of five cases b... » read more

Week In Review: Design, Low Power


Synopsys acquired Silicon Frontline Technology, a provider of an electrical layout verification solution for mixed-signal and analog designs, large-scale power semiconductor devices, and electrostatic discharge protection networks. "This acquisition enables Synopsys to extend the capabilities of our design analysis portfolio and help build out a system-level electrical analysis platform. We als... » read more

Week In Review: Design, Low Power


MLCommons debuted the latest results for the MLPerf Inference v3.0 and Mobile v3.0 benchmark suites, which measure the performance and power-efficiency of applying a trained machine learning model to new data in data center, edge, and mobile use cases. Overall, MLCommons said the results showed both power efficiency improvements and significant gains in performance in some benchmark tests. Seve... » read more

Chip Industry’s Technical Paper Roundup: Feb. 14


New technical papers recently added to Semiconductor Engineering’s library: [table id=80 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

RSFQ Logic Based Logic Locking Technique For Immunizing Against SAT-Based Attacks


A new technical paper titled "C-SAR: SAT Attack Resistant Logic Locking for RSFQ Circuits" was published (preprint) by researchers at University of Southern California. Abstract: "Since the development of semiconductor technologies, exascale computing and its associated applications have required increasing degrees of efficiency. Semiconductor-transistor-based circuits (STbCs) have strugg... » read more

Novel In-Pixel-in-Memory (P2M) Paradigm for Edge Intelligence (USC)


A new technical paper titled "A processing-in-pixel-in-memory paradigm for resource-constrained TinyML applications" was published by researchers at University of Southern California (USC). According to the paper, "we propose a novel Processing-in-Pixel-in-memory (P2M) paradigm, that customizes the pixel array by adding support for analog multi-channel, multi-bit convolution, batch normaliza... » read more

Week In Review: Design, Low Power


Infineon acquired Industrial Analytics, a provider of AI-enabled industrial equipment monitoring. Its solution can monitor plants for early detection of critical developments, based on analysis and evaluation of vibrations, and evaluate data for both predictive and prescriptive maintenance. "Industrial Analytics has outstanding expertise in the area of predictive analysis for industrial machine... » read more

Manufacturing Bits: Nov. 8


Plasma R&D with quantum computing Rigetti Computing, a developer of quantum computers, has been selected to lead a quantum simulation project for the development of fusion energy. The project was awarded by the Department of Energy (DoE). Under the plan, Rigetti will collaborate with Lawrence Livermore National Laboratory and the University of Southern California on a three-year, $3.1 m... » read more

Manufacturing Bits: Oct. 26


GaN finFETs, scaling GaN At the upcoming IEEE International Electron Devices Meeting (IEDM) in San Francisco, a slew of entities will present papers on the latest technologies in R&D. The event, to be held Dec. 11–15, involve papers on advanced packaging, CMOS image sensors, interconnects, transistors, power devices and other technologies. At IEDM, Intel will present a paper on a GaN-... » read more

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