Deep Learning (DL) Applications In Photomask To Wafer Semiconductor Manufacturing

By eBeam Initiative - 17 Apr, 2024 - Comments: 0

How Advantest Corporation, ASML, Fraunhofer, imec, Siemens EDA and others are using deep learning in semiconductor manufacturing. Click here to read more. » read more

Elimination Of Die-Pop Defect By Vacuum Reflow For Ultrathin Die With Warpage In Semiconductor Packaging Assembly

By Amkor - 18 Jan, 2024 - Comments: 0

Semiconductor die thickness is getting thinner over time due to improvement of power efficiency in advance power electronic packages. Ultrathin die with convex warpage can easily deteriorate the solder void removal process during solder reflow, leading to various packaging reliability issues. In particular, a new type of packaging defect phenomenon—die-pop—is observed. Vacuum reflow process... » read more

In-Product BTI Aging Sensor For Reliability Screening And Early Detection Of Material At Risk

By PDF Solutions - 09 Jan, 2024 - Comments: 0

We have developed a new reliability monitoring suite, within a proprietary IP block that we call a CV Core, with aging sensors embedded in the product layout and testable through the product I / O interface. We illustrate the application of the sensor suite with an example of the PMOS NBTI monitor, testable at the wafer level during product electrical wafer sort (EWS), as well after packaging a... » read more

Challenges Grow For Creating Smaller Bumps For Flip Chips

By Anne Meixner - 18 May, 2023 - Comments: 0

New bump structures are being developed to enable higher interconnect densities in flip-chip packaging, but they are complex, expensive, and increasingly difficult to manufacture. For products with high pin counts, flip-chip [1] packages have long been a popular choice because they utilize the whole die area for interconnect. The technology has been in use since the 1970s, starting with IBM�... » read more

Where And When End-to-End Analytics Works

By Anne Meixner - 10 May, 2022 - Comments: 0

With data exploding across all manufacturing steps, the promise of leveraging it from fab to field is beginning to pay off. Engineers are beginning to connect device data across manufacturing and test steps, making it possible to more easily achieve yield and quality goals at lower cost. The key is knowing which process knob will increase yield, which failures can be detected earlier, and wh... » read more

Big Payback For Combining Different Types Of Fab Data

By Anne Meixner - 07 Dec, 2021 - Comments: 1

Collecting and combining diverse data types from different manufacturing processes can play a significant role in improving semiconductor yield, quality, and reliability, but making that happen requires integrating deep domain expertise from various different process steps and sifting through huge volumes of data scattered across a global supply chain. The semiconductor manufacturing IC data... » read more

Curvilinear Design Benefits For Wafers

By Jan Willis - 21 Oct, 2021 - Comments: 0

Throughout this blog series the focus has been on curvilinear photomasks – the benefits, enablers, and challenges. It leads to the obvious question that Aki Fujimura, CEO of D2S, put to the panel of luminaries. If leading-edge mask shops are ready for curvilinear shapes on mask enabled by curvilinear ILT, multi-beam mask writers and the mask design chain, can we have curvilinear target shapes... » read more

Why Wafer Bumps Are Suddenly So Important

By Anne Meixner - 10 Aug, 2021 - Comments: 2

Wafer bumps need to be uniform in height to facilitate subsequent manufacturing steps, but a push for 100% inspection in packaging in mission-critical markets is putting a strain on existing measurement technologies. Bump co-planarity is essentially a measure of flatness. Specifically, it measures the variation in bump height, which may have a target, for example, of about 100 microns. As a ... » read more

Geo-Spatial Outlier Detection

By Anne Meixner - 19 Jul, 2021 - Comments: 0

Comparing die test results with other die on a wafer helps identify outliers, but combining that data with the exact location of an outlier offers a much deeper understanding of what can go wrong and why. The main idea in outlier detection is to find something in or on a die that is different from all the other dies on a wafer. Doing this in the context of a die’s neighbor has become easie... » read more

Cleaning Up During IC Test

By Anne Meixner - 06 Jul, 2021 - Comments: 2

Test is a dirty business. It can contaminate a unit or wafer, or the test hardware, which in turn can cause problems in the field. While this has not gone unnoticed, particularly as costs rise due to increasing pin and ball density, and as more chips are bundled together in a package, the cost of dirt continues to be a focus. Cleaning recipes for test interface boards are changing, and analy... » read more

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Knowledge Centers
Entities, people and technologies explored

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