tag: Xilinx

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 12 Oct, 2018 - Comments: 0

Deals Dialog Semiconductor made a blockbuster deal with Apple – the chip company will license power management technologies and transfer some assets to Apple, which will use them in their internal chip research and development. More than 300 Dialog employees, mostly engineers, will join Apple, which will pay $300 million in cash for the transaction and prepay another $300 million for Dialog ... » read more

Defect Challenges Growing In Advanced Packaging
By Mark LaPedus - 08 Oct, 2018 - Comments: 0

The current defect inspection systems for packaging are running out of steam for the latest advanced packages, prompting the need for new tools in the market. In response, several vendors are rolling out new defect inspection systems for use in various advanced packages, such as 2.5D/3D technologies and fan-out. The new defect inspection systems are more capable than the previous tools, but ... » read more

So Many Waivers Hiding Issues
By Brian Bailey - 05 Oct, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss problems associated with domain crossings with Alex Gnusin, design verification technologist for Aldec; Pete Hardee, director, product management for Cadence; Joe Hupcey, product manager and verification product technologist for Mentor, a Siemens Business; Sven Beyer, product manager design verification for OneSpin; and Godwin Maben, applications en... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 05 Oct, 2018 - Comments: 0

Internet of Things Amazon Web Services announced that Iridium Communications has joined the AWS Partner Network. AWS and Iridium have collaborated on development of Iridium CloudConnect, a service that enables worldwide coverage for Internet of Things applications through Iridium’s satellite network. AWS IoT is being paired with Iridium IoT services as a result. IHS Markit forecasts there wi... » read more

Week In Review: Design, Low Power
By Jesse Allen - 05 Oct, 2018 - Comments: 0

Mirabilis Design debuted an AI-driven tool for performance analysis and architecture exploration of SoCs and embedded systems. VisualSim AI Processor Generator creates pipeline-accurate models that have port integration with standard buses and memories, which is used to compare different processor families, optimize the specification and identify system bottlenecks. The generated model supports... » read more

Big Changes For Mainstream Chip Architectures
By Ed Sperling - 23 Aug, 2018 - Comments: 3

Chipmakers are working on new architectures that significantly increase the amount of data that can be processed per watt and per clock cycle, setting the stage for one of the biggest shifts in chip architectures in decades. All of the major chipmakers and systems vendors are changing direction, setting off an architectural race that includes everything from how data is read and written in m... » read more

Week In Review: Design, Low Power
By Jesse Allen - 27 Jul, 2018 - Comments: 0

Tools & IP Cadence uncorked the latest version of the Sigrity signal integrity analysis family of tools, adding a 3D design and 3D analysis environment integrated with Allegro PCB tools that allows users to import mechanical structures, such as cables and connectors, and merge them with the PCB for modeling and optimization as one structure. It also adds full Rigid-Flex PCB extraction from... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 20 Jul, 2018 - Comments: 0

Chipmakers TSMC has reduced its outlook for 2018 revenue and capital spending, according to Bloomberg. The company blamed the outlook on sluggish “mobile and digital currency mining demand,” according to the report. Samsung has developed the industry’s first 10nm-class 8-gigabit LPDDR5 DRAM. The 8Gb LPDDR5 boasts a data rate of up to 6,400 megabits-per-second (Mb/s), which is 1.5 tim... » read more

Week In Review: Design, Low Power
By Jesse Allen - 20 Jul, 2018 - Comments: 0

Aldec expanded the rule-checking capabilities of its ALINT-PRO tool, adding twice as many FSM checks and new graphical representations to aid state exploration. Also included is enhanced setup automation for complex Xilinx Vivado and ISE projects that automatically organizes a workspace to deliver hierarchical and incremental DRC and CDC analysis. Xilinx acquired AI startup DeePhi Technology... » read more

Bridges Vs. Interposers
By Mark LaPedus - 12 Jul, 2018 - Comments: 4

The number of technology options continue to grow for advanced packaging, including new and different ways to incorporate so-called silicon bridges in products. For some time, Intel has offered a silicon bridge technology called Embedded Multi-die Interconnect Bridge (EMIB), which makes use of a tiny piece of silicon with routing layers that connects one chip to another in an IC package. In ... » read more

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