Startup Funding: March 2024


The challenge of moving data from place to place is increasingly a key concern for chip and system designers, and investors are taking note. Numerous startups developing interconnect technologies received significant backing in March, with approaches spanning chiplet-enabling PHYs, photonic fabrics for disaggregated compute and memory, and telecom transceiver modules. Several new startups la... » read more

Week In Review: Manufacturing, Test


The more than 1,400 attendees at this week’s IEDM, which celebrated the 75th anniversary of the transistor, were clearly focused on making the next 75 years of semiconductors even more remarkable than the last. Intel, Samsung, TSMC, STMicroelectronics, GlobalFoundries and imec announced breakthrough devices, materials, and even integration approaches. These included: Intel showcased adva... » read more