Week in Review: Design, Low Power

Acquisitions

Renesas completed its acquisition of Reality Analytics, which specializes in embedded AI and TinyML solutions for advanced non-visual sensing in automotive, industrial and commercial products.

Siemens Digital Industries Software will acquire Zona Technology, which develops aerospace simulation software. Siemens plans to integrate that software into its wXcelerator and Simcenter portfolios, allowing users to access a new tool for airframe structure design and certification analysis digital thread.

Memory

Rambus expanded its DDR5 memory interface chip portfolio with the Rambus Serial Presence Detect Hub and Temperature Sensor. The two components work in concert with Rambus Registering Clock Driver to create high-performance, high-capacity memory solutions for servers, desktops and laptops.

ETH Zurich researcher Minesh Patel published an award-winning paper titled “Enabling Effective Error Mitigation in Memory Chips That Use On-Die Error-Correcting Code.” The research studies “memory errors, examine how on-die ECC obfuscates their statistical characteristics, and develop new testing techniques to overcome the obfuscation.”

Design Considerations & Tools

Keysight announced that its Keysight Open Radio Access Network Architecture (KORA) is moving to the cloud, and that its LoadCore software for testing 5G Core is now available as a metered, pay-as-you-go product through the AWS Marketplace. The company also said that KORA enabled MICAS to obtain one of the first O-RAN certifications for its 5G Open RAN Radio Unit (O-RU).

The design cycle is generating more data than ever before. Industry experts have several ideas about what to do with it.

What is it about heterogenous designs that requires new tools and approaches? Find out here.

Ansys won the Best Paper Award from IEEE’s International Symposium on Hardware Oriented Security and Trust. The paper introduced an EDA tool called Ansys RedHawk-SC Security, which assesses unintended data leakage vulnerabilities. Such vulnerabilities include those stemming from power consumption, electromagnetic emission, thermal emission, and other multiphysics phenomena.

University of Florida’s FICS Research Institute just published new research, titled “Secure Physical Design.” The paper addresses how to ensure end-to-end trustworthy chip design flow with “security sign-off during physical design flow.”

Quantum Computing and Data Centers

Google’s cloud data center in London reported an outage Tuesday, as a record-breaking heat wave pummeled Europe.

The future of quantum computing hinges on the ability to create a fault-tolerant quantum processor. One path forward, according to IBM, is quantum error mitigation.

AI is being used to accelerate edge computing using less power.

Upcoming Events

July 22: Hybrid International Symposium on Failure Analysis and Material Testing, Erlangen, Germany.
Aug. 2-4, Flash Memory Summit Conference & Expo, Santa Clara, CA.
Aug. 10-12, USENIX Security Symposium in Boston, Massachusetts.
Aug. 21-23, Hot Chips (virtual).
Aug. 21-25: SPIE Optics and Photonics, San Diego, CA.

In Case You Missed It

Which semiconductor company linked its recent acquisition to a $1 billion per year market opportunity? The answer can be found here.

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