Week In Review: Design, Low Power

EU to spend $286.5M on HPC; NIST and AIM collaborate on high-speed photonic chips; Samsung develops 16-gigabit DDR5 DRAM on 12nm; Keysight test cases enable first verifications of 3GPP Rel-16.



The European Union said it will spend the equivalent of $286.5 million on a high performance computing ecosystem based on RISC-V. According to the call for proposals, the aim of the project is to “establish a partnership between the EuroHPC JU and a consortium of industry, research organizations and institutions in HPC to the development of innovative HPC hardware and software technology based on the open RISC-V ecosystem.”

RISC-V is unlikely to replace existing chip architectures any time soon, but it continues to attract significant attention from the hardware community and is beginning to appear in heterogeneous SoCs and packages.


AIM Photonics and the National Institute of Standards and Technology (NIST) agreed to collaborate on a project aimed at creating new chip designs for high-speed communications. Per the agreement, NIST will design electrical calibration structures for photonic chips that operate at speeds up to 110 GHz. AIM Photonics will integrate the calibration structures into a process design kit.

The past year was full of surprises for the semiconductor industry, including an increased public awareness of hardware and EDA as well as decreased investor appetite for risk. Taking a system-level approach to designing for multiple die is both challenging and necessary.


Samsung announced it developed a 16-gigabit DDR5 DRAM built using a 12nm process technology, an industry first. The product completed its evaluation for compatibility with AMD. “With exceptional performance and power efficiency, we expect our new DRAM to serve as the foundation for more sustainable operations in areas such as next-generation computing, data centers and AI-driven systems,” said Jooyoung Lee, executive vice president of DRAM Product & Technology at Samsung Electronics.

ETH Zurich developed an in-DRAM rowhammer mitigation approach that can protect devices even at very low thresholds.

Networks and Connectivity

Keysight said its products were used to submit the first verifications of 3GPP Release 16 (Rel-16) protocol conformance test cases for devices supporting the 5G E-UTRAN New Radio (NR) – Dual Connectivity (EN-DC) configuration for 5G NR non-standalone devices, enabling operators to use both 4G E-UTRAN and 5G network resources simultaneously. “The industry needs this early availability of 3GPP 5G NR test cases for Rel-16 to accelerate the introduction of designs for smart factory, autonomous vehicle, and smart city applications. Keysight continues to reinforce technical leadership by being first to submit test cases to 3GPP RAN5, a working group within 3GPP that is focused on the specification of conformance testing at the radio interface for user equipment,” said Muthu Kumaran, general manager of Keysight’s Device Validation Solutions business.


President Biden signed the Quantum Cyber Bill into law to defend against quantum-enabled data breaches.

Quantum Computing Inc. launched a subscription service for dedicated access to it quantum computing systems.

And deep in the gee-whiz category, researchers at Caltech claim to have observed wormhole-like teleportation on a quantum computer. Beam me up, Scotty.

Upcoming Events

Jan. 5-8, CES 2023, Las Vegas, NV and online

Jan. 8-11, ISS 2023: Industry Strategy Symposium, Half Moon Bay, CA

Jan. 16-19, Asia & South Pacific Design Automation Conference, Japan

Jan. 24-26, Chiplet Summit, San Jose, CA

Jan. 28-Feb. 2, SPIE Photonics West, San Francisco, CA

Jan. 30-Feb.1, SPIE: AR/VR/MR, San Francisco, CA

Find more events here.

In Case You Missed It

Check out the new Systems & Design newsletter as well as the Low Power, High Performance newsletter for these highlights and more:

  • Adapting to broad shifts essential in 2022
  • Stresses in chips affecting reliability at advance nodes
  • Challenges with adaptive control

If you’d like to receive Semiconductor Engineering newsletters and alerts via email, please subscribe here.

Leave a Reply

(Note: This name will be displayed publicly)