Blog Review: Dec. 21

Custom SoCs for IoT; silicon photonics primer; V2V requirements?; OSAT automation; ISO 26262.

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Mentor’s Jeff Miller and ARM’s Nandan Nayampally contend that it’s easier than ever to design custom SoCs.

Cadence’s Paul McLellan provides a basic primer on silicon photonics, from a presentation by Gilles Lamant.

The US Department of Transportation is considering requiring the inclusion of vehicle-to-vehicle communication in new cars, says Synopsys’ Robert Vamosi.

Applied’s Shekar Krishnaswamy argues that fab automation technologies can help OSATs deal with the transition to wafer-level packaging.

ARM’s Javier Orensanz shares the company’s plans for the acquisition of HPC debug and performance analysis tools provider Allinea Software.

Rambus’ Aharon Etengoff checks out the use of Bluetooth and Wi-Fi beacons to provide targeted, location-based marketing to consumers.

Cadence’s Charles Qi continues his video series on automotive functional safety and takes a closer look at the benefits and impact of the ISO 26262 standard.

Mentor’s Russell Klein posits that techniques used to capture bank robbers can help find bugs.

Synopsys’ Michael Posner shares a winter tale of surviving without USB (or power).

And if you missed last week’s Manufacturing, Design & Test newsletter, check out these featured blogs:

Editor In Chief Ed Sperling argues that it’s time for the semiconductor industry to establish a new set of definitions.

Executive Editor Mark LaPedus examines the buzz around next-generation technologies and issues.

Mentor Graphics’ Elven Huang points to a better way to find and debug memory issues in finFET designs.

National Instruments’ David Vye digs into why measurement is required to validate assumptions prior to fabrication.

UMC’s Steve Sharp explains why a long history and continued improvements are keeping 40nm processes relevant.

Coventor’s David Fried looks at the top back end of line issues by way of an IEDM panel discussion.