The Week In Review: Design


IP ARM unveiled a suite of products focused on the IoT, with new processors, radio technology, subsystems, end-to-end security and a cloud-based services platform. Included are Cortex-M23 and Cortex-M33, the first embedded processors based on the ARMv8-M architecture. The Cortex-M33 features configuration options including a coprocessor interface, DSP and floating point computation, while th... » read more

“Eating Your Own Dog Food” When Developing An Emulator


It’s a great week for emulation week with ARM TechCon happening in Silicon Valley. Palladium Z1 is a finalist for Best Product in the categories “Best Chip” and “Best System” and we started the week with an announcement that Fujitsu adopted the Cadence Palladium Z1 Enterprise Emulation Platform for their ARMv8-based “Post-K Supercomputer Development.” Cadence has faced some of the... » read more

The Week In Review: IoT


Security The Industrial Internet Consortium this week unveiled the Industrial Internet Security Framework, a set of specifications for connected health-care devices and hospitals, intelligent transportation, smart electrical grids, smart factories, and other cyber-physical systems in the Internet of Things. AT&T, Fujitsu, Hitachi, Infineon Technologies, Intel, Microsoft, and Symantec are among... » read more

The Week in Review: IoT


Technology The Internet of Things got some attention at this week’s Intel Developer Forum in San Francisco. Intel CEO Brian Krzanich introduced the Joule compute module in his opening-day keynote address. The module is a high-performance developer platform supporting Intel RealSense depth-sensing cameras. Canonical, Microsoft, and PivotHead were among the IDF exhibitors demonstrating the Jou... » read more

Keeping The Lights On


IoT is comprised of numerous industries. For the sake of analysis, these can be segmented into several tiers that function as independent networks or integrated complicated meshes. In my November post I examined the three-tier IoT architecture at a high level. Then last month I focused on the rapidly expanding market of intelligent gateways. Gateways receive information from cloud applicatio... » read more

What Happened To GaN And SiC?


About five years ago, some chipmakers claimed that traditional silicon-based power MOSFETs had hit the wall, prompting the need for a new power transistor technology. At the time, some thought that two wide-bandgap technologies—gallium nitride (GaN) on silicon and silicon carbide (SiC) MOSFETs—would displace the ubiquitous power MOSFET. In addition, GaN and SiC were supposed to pose a t... » read more

RF SOI Foundry Biz Heats Up


The foundry business is undergoing a new round of acquisition and fab expansion activity. As before, the big foundry vendors are getting bigger, while some may fall by the wayside. And at times, the events cause some uncertainty, if not jitters, in the supply chain. For example, [getentity id="22819" comment="GlobalFoundries"]in October signed a definitive agreement to acquire the chip uni... » read more

The Week In Review: Manufacturing


Tesla Motors plans to build a new 35-GWh, lithium-ion cell production facility for its electric vehicles. It sounds like a good idea. But the factory will bring about only a modest reduction in battery costs, and could create significant overcapacity in the arena, according to Lux Research. “The Gigafactory will only reduce the Tesla Model 3’s cost by $2,800, not enough to sway the success ... » read more

Fujitsu Reorgs For Manufacturing


Fujitsu officially announced its intention of reorganizing its semiconductor manufacturing businesses, including dividing the Aizu Wakamatsu factory and Mie factory as branches of the foundry companies. The rest of the organization, including the system memory department and Fujitsu Electronics will become a part of Fujitsu’s semiconductor group. The new Foundry Company will also be a part of... » read more

The Week In Review: Manufacturing


Intel announced two new technologies for foundry customers. One technology, dubbed Embedded Multi-die Interconnect Bridge (EMIB), is available to 14nm foundry customers. Instead of an expensive silicon interposer with TSVs, a small silicon bridge chip is embedded in the package, enabling high density die-to-die connections only where needed. EMIB eliminates the need for TSVs and specialized int... » read more

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