The Week In Review: Manufacturing


Intel announced that the company’s former CEO and chairman, Andrew Grove, passed away. He was 79. Present at Intel’s 1968 founding with Robert Noyce and Gordon Moore, Grove became Intel’s president in 1979 and CEO in 1987. He served as chairman from 1997 to 2005. “We are deeply saddened by the passing of former Intel Chairman and CEO Andy Grove,” said Intel CEO Brian Krzanich, in a st... » read more

Charting A New Course For Semiconductors


The semiconductor industry is at an inflection point facing challenges, including rising development costs, shrinking margins, market saturation and unprecedented consolidation. Although no stranger to boom and bust cycles, semiconductor companies are actively seeking a return to stability via a more sustainable and collaborative business paradigm. In this context, Rambus and the Global S... » read more

Don’t Forget To Consider Productivity In Semiconductor IP Evaluations


When companies consider purchasing Semiconductor IP (SIP), they often have a strict procedure for evaluating third-party vendors and their products. If they don’t have a set way of evaluating IP, the Global Semiconductor Alliance (GSA) has developed a Hard IP Licensing Risk Assessment Tool to aid in assessing the value of IP (there is also a quality assessment tool). This aid is part of the G... » read more

The Week In Review: Design/IoT


Tools Calypto rolled out its third-generation high-level synthesis platform after three years of development, adding granular control over which regions are optimized and the ability to work top-down and bottom-up—basically allowing designers to zoom in and out as needed. In addition, the tool has a 10X increase in capacity and supports SystemC and C++. eSilicon unveiled its online conf... » read more

New Product Introduction Process For Heterogeneous 2.5D Devices


For the past few years, the most popular topics in the 2.5D space have been: The design tools Foundry processes for through-silicon vias, temporary bonding and bump architecture The assembly process, such as what is first bonded to what The industry is at the point where the open variables on these topics are narrowing, and other critical aspects need to get far better attention. The... » read more

Experts At The Table: The Internet Of Everything


By Ed Sperling System-Level Design sat down to discuss the Internet of Things with Jack Guedj, president and CEO of Tensilica; John Heinlein, vice president of marketing for the physical IP division of ARM; Kamran Izadi, director of sourcing and supplier management at Cisco; and Oleg Logvinov, director of market development for STMicroelectronics’ Industrial and Power Conversion Division. Wh... » read more

Experts At The Table: The Internet Of Everything


By Ed Sperling System-Level Design sat down to discuss the Internet of Things with Jack Guedj, president and CEO of Tensilica; John Heinlein, vice president of marketing for the physical IP division of ARM; Kamran Izadi, director of sourcing and supplier management at Cisco; and Oleg Logvinov, director of market development for STMicroelectronics’ Industrial and Power Conversion Division. Wh... » read more

Experts At The Table: The Internet Of Everything


By Ed Sperling System-Level Design sat down to discuss the Internet of Things with Jack Guedj, president and CEO of Tensilica; John Heinlein, vice president of marketing for the physical IP division of ARM; Kamran Izadi, director of sourcing and supplier management at Cisco; and Oleg Logvinov, director of market development for STMicroelectronics’ Industrial and Power Conversion Division. Wh... » read more

AMS Challenges Growing


By David Lammers Analog and mixed signal (MS) devices will play an ever-increasing role in saving energy, particularly as the “Internet of Things” expands to about 10 billion units per year over the next decade. But as leading-edge design rules scale to 28nm and below, enhanced with high-k/metal gate technologies, it is becoming increasingly challenging to integrate AMS devices on SoCs. ... » read more

Power Model Complexity Grows


By Ed Sperling The number of factors required for an effective power model has far surpassed the capabilities of even the most detailed spreadsheet at 45nm and beyond. It has now entered the realm of complex databases and architectural tradeoffs, and those tradeoffs will become even more complex as 3D stacking takes root over the next 24 months. The idea of modeling power is hardly new, but... » read more

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