By Mark LaPedus
Advanced 2.5D/3D chip stacking has a number of challenges and is still a few years away from mass production.
In fact, mass production may not occur until 2015 or 2016. But OEMs can ill afford to sit still and wait for 2.5D/3D technology to mature. So, until 2.5D/3D is ready for prime time, chipmakers and IC-packaging houses are under pressure to innovate and extend current ... » read more