Using Data To Improve Yield


Semiconductor manufacturers are always looking for an edge to improve operating efficiency and to increase yields on chip lots. For some, the answers include big data analytics, as well as technology to move that data around more quickly. Chipmakers, board assemblers, and related businesses are turning to the Internet of Things, especially [getkc id="78" kc_name="Industrial IoT"] technology... » read more

The Rising Value Of Data


The volume of data being generated by a spectrum of devices continues to skyrocket. Now the question is what can be done with that data. By Cisco's estimates, traffic on the Internet will be 3.3 zetabytes per year by 2021, up from 1.2 zetabytes in 2016. And if that isn't enough, the flow of data isn't consistent. Traffic on the busiest 60-minute period in a day increased 51% in 2016, compare... » read more

Module Testing Adds New Challenges


System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is something more than a chip package and a great deal smaller than most printed circuit boards. Testing these modules often requires system-level test. These modules typically will be inserted int... » read more

Transistor Aging Intensifies At 10/7nm And Below


Transistor aging and reliability are becoming much more troublesome for design teams at 10nm and below. Concepts like ‘infant mortality’ and 'bathtub curves' are not new to semiconductor design, but they largely dropped out of sight as methodologies and EDA tools improved. To get past infant mortality, a burn-in process would be done, particularly for memories. And for reliability, which... » read more

Are All Known Good Tested Devices Created Equal?


Your known good parts all had passed their required wafer sort, final test, and system-level tests and were shipped to your customers. However, as we all know, a known good part or device sometimes does not stay good and may end up failing prematurely in the field and flagged as an RMA (return material authorization) by your customer. But why is it that some good parts fail early and others las... » read more

Tracking Down Errors With Data


Michael Schuldenfrei, CTO at [getentity id="22929" comment="Optimal+"], sat down with Semiconductor Engineering to discuss how data will be used and secured in the future, the accuracy of that data, and what impact it can have on manufacturing. What follows are excerpts of that conversation. SE: Can data be shared across the supply chain? Schuldenfrei: We believe it has to happen. If it d... » read more

Test at “West”


As you wander through the North Hall of Moscone Center this week, you may notice that some of the big names in automated test equipment are not on the SEMICON West show floor this year. Advantest America has a booth, but the same cannot be said of Teradyne or Xcerra. Some of the bigger names in test and measurement instruments won’t be found exhibiting at SEMICON West, either – such as Keys... » read more

The Week In Review: Manufacturing


Chipmakers Inotera, known as Micron Technology Taiwan, suspended its operations after an accident occurred at its Fab 2 facility in Taoyuan City on July 1, according to TrendForce. Inotera is responsible for manufacturing Micron’s LPDDR4 products that go into Apple’s supply chain for the iPhone, according to the market research firm. The problem involved a malfunction in the fab. “Th... » read more

The Week In Review: Manufacturing


Chipmakers UMC has appointed two senior vice presidents--S.C. Chien and Jason Wang--as co-presidents of the company, following Po-Wen Yen’s retirement as UMC’s CEO. The co-presidents are accountable for the overall performance of UMC. They will report to UMC Chairman Stan Hung. Chien will focus on the core manufacturing and technology aspects of UMC, including R&D and operations. Wang wil... » read more

Chip Test Shifts Left


“Shift left” is a term traditionally applied to software testing, meaning to take action earlier in the V-shaped time line of a project. It has recently been touted in electronic design automation and IC design, verification, and test. “Test early and test often” is the classic maxim of software testing. What if that concept could also be implemented in semiconductor testing, to redu... » read more

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