Is Product Quality Getting Lost In The IIoT?


Manufacturing operations have continuously evolved using data capture and management to assess and test production effectiveness on the manufacturing floor. The advent of the Industrial Internet of Things (IIoT) and its anticipated ability to track and manage the factory environment with machine-to-machine process analytics heralds yet another transformation, promising a higher level of data in... » read more

An Advanced Product Analytics Platform For Industry 4.0 And IIoT


Industry 4.0, Industrie 4.0 or the fourth industrial revolution, is the current trend of automation and data exchange in manufacturing technologies. IIoT is a critical component of Industry 4.0 combining sensing, intelligent analytics and Internet/cloud connectivity. One of the main tasks of Industry 4.0 is mass personalization (meeting the customer’s needs more effectively and efficiently) ... » read more

2.5D, FO-WLP Issues Come Into Focus


Advanced packaging is beginning to take off after years of hype, spurred by 2.5D implementations in high-performance markets and fan-out wafer-level packaging for a wide array of applications. There are now more players viewing packaging as another frontier driving innovation. But perhaps a more telling sign is that large foundries in Taiwan have begun offering packaging services to customer... » read more

Quality Issues Widen


As the amount of semiconductor content in cars, medical and industrial applications increases, so does the concern about how long these devices will function properly—and what exactly that means. Quality is frequently a fuzzy concept. In mobile phones, problems have ranged from bad antenna placement, which resulted in batteries draining too quickly, to features that take too long to load. ... » read more

The Week In Review: Manufacturing


Chipmakers Toshiba’s problems have gone from bad to worse. “Toshiba postponed its earnings call by up to one month, and the chairman resigned. The provisional results show large losses in its nuclear power business, while the NAND operations remain very profitable,” said Weston Twigg, an analyst with Pacific Crest Securities, in a research note. “The next few months appear very uncerta... » read more

The Week In Review: IoT


Consortia Optimal+ said this week that it has joined the Industrial Internet Consortium. “The Industrial Internet of Things (IIoT) will have a tremendous impact on industries worldwide. The application of smart manufacturing, combined with the collection and analysis of in-use/field stage data, will deliver powerful insights to brand owners and enable them to achieve dramatic improvements in... » read more

Addressing Test Time Challenges


Unit test time on automated test equipment (ATE) is one of the major components that affects the total cost of manufacturing for semiconductor suppliers. The test programs for each unit can be comprised of thousands of parametric and functional tests that are performed to screen out defective units or dies. However, tester time is expensive, so suppliers are always looking for ways to reduce th... » read more

Betting On Wafer-Level Fan-Outs


Advanced packaging is starting to gain traction as a commercially viable business model rather than just one more possible option, propelled by the technical difficulties in routing signals at 10nm and 7nm and skyrocketing costs of device scaling on a single die. The inclusion of a [getkc id="202" kc_name="fan-out"] package for logic in Apple's iPhone 7, based on TSMC's Integrated Fan-Out (... » read more

Grappling With Manufacturing Data


As complexity goes up with each new process node, so does the amount of data that is generated, from initial GDSII to photomasks, manufacturing, yield and post-silicon validation. But what happens to that data, and what gets shared, remain a point of contention among companies across the semiconductor ecosystem. The problem is that to speed up the entire design through manufacturing process,... » read more

Gaps Emerge In Test Flows


Gaps are showing up in test flows as chipmakers add more analog content and push into more safety-critical applications, exposing more points at which designs need to be tested as well as weaknesses in current tools and methodologies. The cornerstone of the [getkc id="76" kc_name="IoT"], and connected devices such as self-driving cars, is a heavy reliance on [getkc id="187" kc_name="sensors"... » read more

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