IoT Will Grow Faster With More Flexible Wireless Design


The fascinating numbers-within-the-numbers for the forecasted growth in Internet of Things (IoT) devices is this: By 2020, it’s estimated there will be nearly 2 billion low-power radio-connected devices, specifically with Bluetooth 5 and 802.15.4 (Zigbee and Thread). Those numbers are compelling because not only is that a quadrupling of the amount of low-power radio devices today, but the val... » read more

All I Want For Christmas…


As I write this, we’re heading into the 2016 holiday season. December 21 is also the shortest day of the year, so I better get right to the point. 2016 has been a year of many surprises. The spectacular consolidation in the semiconductor industry has permanently altered the landscape.  It has created new, world-class capability and left a few gaps as well. 2.5D designs are finally moving ... » read more

DO-254 Explained


This white paper, the first in a series of DO-254-related white papers, will explore the high-level concepts and activities within the DO-254 Design Assurance Guidance for Airborne Electronic Hardware specification, why they exist, and what they mean. In this paper, we will explore the safety-related concepts of requirements traceability, design assurance levels, the overall DO-254-compliant fl... » read more

Embedded Software Verification Issues Grow


Embedded software is becoming more critical in managing the power and performance of complex designs, but so far there is no consensus about the best way to approach it—and that's creating problems. Even with safety-critical standards such as DO-178C for aerospace and [gettech id="31076" comment="ISO 26262"] for automotive, different groups of tool providers approach software from differen... » read more

Accelerating DO-254 Approval


This white paper explores software tools as they relate to meeting the DO-254 Design Assurance Guidance for Airborne Electronic Hardware specifications, and what steps must be performed in order to use your typical design automation tools such as simulation, synthesis, etc. In this paper, we will explore how DO-254 views tools, learn which tools receive the highest scrutiny and why, and how to ... » read more

How Many Nanometers?


What’s the difference between a 10nm and a 7nm chip? That should be a straightforward question. Math, after all, is the only pure science. But as it turns out, the answer is hardly science—even if it is all about numbers. Put in perspective, at 65nm, companies defined the process node by the half pitch of the first metal layer. At 40/45nm, with the cost and difficulty of developing n... » read more

What Can Go Wrong In Automotive


Semiconductor Engineering sat down to discuss automotive engineering with Jinesh Jain, supervisor for advanced architectures in Ford’s Research and Innovation Center in Palo Alto; Raed Shatara, market development for automotive infotainment at [getentity id="22331" comment="STMicroelectronics"]; Joe Hupcey, verification product technologist at [getentity id="22017" e_name="Mentor Graphics"]; ... » read more

What’s Important For IoT—Power, Performance Or Integration?


Semiconductor Engineering sat down with Steve Hardin, director of product development for AT&T's IoT Solutions Group; Wayne Dai, CEO of VeriSilicon; John Koeter, vice president of the Solutions Group at [getentity id="22035" e_name="Synopsys"]; and Rajeev Rajan, vice president for IoT at [getentity id="22819" comment="GlobalFoundries"]. What follows are excerpts of that conversation. SE:... » read more

Can Verification Meet In The Middle?


Semiconductor Engineering sat down to discuss these issues with; Stan Sokorac, senior principal design engineer for [getentity id="22186" comment="ARM"]; Frank Schirrmeister, senior group director for product marketing for the system development suite of [getentity id="22032" e_name="Cadence"]; Harry Foster, chief verification scientist at [getentity id="22017" e_name="Mentor Graphics"], Bernie... » read more

Systems Engineering Approach To Electrical Wire Interconnection System (EWIS) Development


The development of the Electrical Wire Interconnection System, or EWIS, for today’s advanced aircraft is one of the most complicated engineering activities around. In addition to having to respond to very high rates of change during development, the aircraft are continually evolving in electronic and electrical content through their entire lifecycle. Relatively new mandates, such as the CFR P... » read more

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