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Ann Mutschler

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Ann Mutschler is senior executive editor at Semiconductor Engineering.

Author's Latest Posts

Are There Enough Cooks In The Kitchen?
By Ann Mutschler - 06 Dec, 2012 - Comments: 0

We work in a fascinating industry, without a doubt, and I watch with interest to see the new technologies that the industry decides to adopt. finFETs and FD-SOI are some really cool technologies, in particular, with great promises. You might also know that we follow innovations in the world of chip design and manufacturing every week from academia and research institutes on all of our communiti... » read more

Experts At The Table: The Sky Isn’t Falling
By Ann Mutschler - 15 Nov, 2012 - Comments: 0

By Ann Steffora Mutschler Semiconductor Manufacturing and Design sat down recently to discuss how the industry is making 3D ICs a reality today with Sylvan Kaiser, chief technology officer at Docea Power; Steve Smith, senior director for 3D-IC strategy at Synopsys; and Ahmed Jerraya, director of strategic design programs at CEA-LETI. SMD: How far are we from having the models we need to ena... » read more

Cellular Stranglehold?
By Ann Mutschler - 08 Nov, 2012 - Comments: 0

Do you ever feel like you are completely at the mercy of your cellular service provider? Yeah, me too. Not only did I have to change providers when I relocated, I had to buy a new phone of course. Since my old phone and my new phone were both iPhones, I thought for sure I could use the same car charger….but no dice. This fact has bothered me for quite some time because it made no sense to ... » read more

Experts At The Table: The Sky Isn’t Falling
By Ann Mutschler - 18 Oct, 2012 - Comments: 0

By Ann Steffora Mutschler SemiMD sat down recently to discuss how the industry is making 3D ICs a reality today with Sylvan Kaiser, chief technology officer at Docea Power; Steve Smith, senior director for 3D-IC strategy at Synopsys; and Dr. Ahmed Jerraya, director of strategic design programs at CEA-LETI. For part one of this series, click here. SemiMD: Because CEA-LETI has direct expe... » read more

Experts at the Table: Black Belt Power Management
By Ann Mutschler - 11 Oct, 2012 - Comments: 0

By Ann Steffora Mutschler Low-Power/High-Performance Engineering sat down to discuss rising integration challenges caused by an increasing amount of black-box IP with Qi Wang, technical marketing group director, solutions marketing, for the low-power and mixed-signal group at Cadence; J. Bhasker, architect at eSilicon Corp.; Navraj Nandra, senior director of product marketing for analog an... » read more

Your Job is Harder Than Mine
By Ann Mutschler - 11 Oct, 2012 - Comments: 0

What I do for a living is listen – a lot – and try to make sense of the myriad challenges that I hear about in terms of design and managing power and performance. What you do as an architect, design engineer or verification engineer is live in the trenches with it all, every day. I admire and respect that. This is especially true as I recently pondered and talked with industry luminaries... » read more

Modeling the Future
By Ann Mutschler - 13 Sep, 2012 - Comments: 0

Every once in a while I read through the employment listings as part of the Semiconductor Manufacturing group on LinkedIn because I find it fascinating to see what employers are looking for even if I am not applying. Particularly for verification engineering position, one of the job responsibilities typically includes development of the architecture for a functional verification environment ... » read more

3D-IC Impact On Computational Lithography?
By Ann Mutschler - 16 Aug, 2012 - Comments: 0

While 3D devices and technology such as through-silicon vias (TSVs) definitely complicate matters in the design, verification and manufacturing space, one might assume there would also be an impact on the computational lithography tools that are used to ensure printability. Have no fear. Industry experts assure us that this is not the case. Lithography expert Chris Mack acknowledged that ... » read more

Getting In the Ballpark
By Ann Mutschler - 09 Aug, 2012 - Comments: 0

I admit it; I still have DAC on the brain. Even though attendance may not have been what the exhibitors would have liked to see, the conference is always a fantastic place to discuss ideas and pick up on trends. One topic I discussed with a number of folks are the challenges associated with design today, from the power-performance balance, 3D stacking to new process nodes and complexity, to nam... » read more

Bubble Gum and Scotch Tape
By Ann Mutschler - 12 Jul, 2012 - Comments: 0

It’s always extremely interesting to talk with actual design engineers, trudging through the trenches of challenges like 3D design. Recently, I was able to speak with Robert Patti, chief technology officer, vice president of design engineering and a director at Tezzaron Semiconductor. The company has been putting 3D designs together for quite some time so I expected to hear that they are u... » read more

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