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Ed Sperling

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Ed Sperling is the editor in chief of Semiconductor Engineering.

Author's Latest Posts

Building AI SoCs
By Ed Sperling - 25 Oct, 2018 - Comments: 0

Ron Lowman, strategic marketing manager at Synopsys, looks at where AI is being used and how to develop chips when the algorithms are in a state of almost constant change. That includes what moves to the edge versus the data center, how algorithms are being compressed, and what techniques are being used to speed up these chips and reduce power. https://youtu.be/d32jtdFwpcE    ... » read more

From Physics To Applications
By Ed Sperling - 25 Oct, 2018 - Comments: 0

Jack Harding, president and CEO of eSilicon, sat down with Semiconductor Engineering to talk about the shift toward AI and advanced packaging, and the growing opportunities at 7nm at a time when Moore's Law has begun slowing down. What follows are excerpts of that conversation. SE: Over the past year, the industry has changed its focus from shrinking features and consolidation to all sorts o... » read more

EUV’s Uncertain Future
By Ed Sperling - 18 Oct, 2018 - Comments: 8

The ground appears to be solidifying under EUV. Intel announced this week it is reducing its stake in ASML to less than 3%, the second such move in a year. Apparently ASML no longer needs outside help. According to the company's earnings report, ASML turned in net sales of €2.776 billion, a slight increase over the €2.447 billion (GAAP) the company reported in Q3 and way up over the €... » read more

Variation At 10/7nm
By Ed Sperling - 18 Oct, 2018 - Comments: 1

Klaus Schuegraf, vice president of new products and solutions at PDF Solutions, explains why variability is a growing challenge at advanced nodes, why middle of line is now one of the big problem areas, and what happens when a via is misaligned due to a small process variation. https://youtu.be/jQfggOnxZJQ » read more

Adding AI To The IoT
By Ed Sperling - 12 Oct, 2018 - Comments: 2

The Internet of Things is about to undergo a radical change, fueled by vast number of things coupled with an almost pervasive presence of AI. The IoT today encompasses a long list of vertical markets, all of them connected to the Internet but not necessarily to each other. The concept of the IoT really began taking off in 2015, when a combination of data analytics, high-speed, affordable and... » read more

Making AI Run Faster
By Ed Sperling - 11 Oct, 2018 - Comments: 0

The semiconductor industry has woken up to the fact that heterogeneous computing is the way forward and that inferencing will require more than a GPU or a CPU. The numbers being bandied about by the 30 or so companies working on this problem are 100X improvements in performance. But how to get there isn't so simple. It requires four major changes, as well as some other architectural shifts. ... » read more

Reliability, Machine Learning And Advanced Packaging
By Ed Sperling - 11 Oct, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss reliability, resilience, machine learning and advanced packaging with Rahul Goyal, vice president in the technology and manufacturing group at Intel; Rob Aitken, R&D fellow at Arm; John Lee, vice president and general manager of the semiconductor business unit at ANSYS; and Lluis Paris, director of IP portfolio marketing at TSMC. What follows ar... » read more

What Is SOTIF?
By Ed Sperling - 10 Oct, 2018 - Comments: 0

Arteris IP’s Kurt Shuler discusses new system-level best-practices approach to automotive design that will be used for both diagnostics and forensics when something goes wrong with autonomous vehicles. https://youtu.be/nC3TkF7c0Oo » read more

Using ASICs For AI Inferencing
By Ed Sperling - 10 Oct, 2018 - Comments: 0

Flex Logix’s Cheng Wang looks at why ASICs are the best way to improve performance and optimize power and area for inferencing, and how to add flexibility into those designs to deal with constantly changing algorithms and data sets. https://youtu.be/XMHr7sz9JWQ » read more

ADAS Meets Anthropology
By Ed Sperling - 10 Oct, 2018 - Comments: 0

Melissa Cefkin, principal scientist and design anthropologist at the Nissan Research Center, sat down with Semiconductor Engineering to talk about how people will interact with autonomous vehicles and AI and why different disciplines are required to make this work. What follows are excerpts of that conversation. SE: Why did Nissan hire an anthropologist? Cefkin: Anthropologists have been ... » read more

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