Mark LaPedus

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Mark LaPedus is Executive Editor for manufacturing at Semiconductor Engineering.

Author's Latest Posts

Manufacturing Bits: Feb. 20
By Mark LaPedus - 20 Feb, 2018 - Comments: 0

Hedgehog spin-vortex crystals The U.S. Department of Energy’s Ames Laboratory has discovered a missing piece to enable novel superconductor devices--the hedgehog spin-vortex crystal phase. Superconductors are devices that have zero electrical resistance, making them attractive for a range of applications. But superconductors must be cooled down to temperatures at or near absolute zero on ... » read more

Will China Succeed In Memory?
By Mark LaPedus - 19 Feb, 2018 - Comments: 5

China's fledging memory makers are expected to reach a major milestone and move into initial production this year, although vendors are already running into various roadblocks. China's domestic vendors are focusing on two markets, 3D NAND and DRAM. In both cases local vendors are either behind in technology, struggling to develop these products, or both. And one vendor recently was hit with ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 16 Feb, 2018 - Comments: 0

Fab tools and test Applied Materials reported record revenue and operating profit in its first quarter ended Jan. 28. Compared to the first quarter of fiscal 2017, Applied grew net sales by 28% to $4.20 billion. In the second quarter of fiscal 2018, Applied expects net sales to be in the range of $4.35 billion to $4.55 billion. “AMAT posted F1Q results above guidance as NAND demand, in p... » read more

5 Takeaways From ISS 2018
By Mark LaPedus - 15 Feb, 2018 - Comments: 0

At the recent Industry Strategy Symposium (ISS) in Half Moon Bay, Calif., there were a multitude of presentations on a number of subjects. The event, sponsored by SEMI, had presentations on the outlook for ICs and equipment. As part of the program, ISS also discussed the latest business and technology trends. In no particular order, here are my five takeaways from ISS: Ranging forecasts ... » read more

Transistor Options Beyond 3nm
By Mark LaPedus - 15 Feb, 2018 - Comments: 18

Despite a slowdown in chip scaling amid soaring costs, the industry continues to search for a new transistor type 5 to 10 years out—particularly for the 2nm and 1nm nodes. Specifically, the industry is pinpointing and narrowing down the transistor options for the next major nodes after 3nm. Those two nodes, called 2.5nm and 1.5nm, are slated to appear in 2027 and 2030, respectively, accord... » read more

Manufacturing Bits: Feb. 13
By Mark LaPedus - 13 Feb, 2018 - Comments: 0

Watching nanowires grow Using X-ray techniques, the University of Siegen and the Karlsruhe Institute of Technology (KIT) have observed the formation of tiny nanowires in gallium arsenide (GaAs) materials in real time. GaAs is used for fiber optics, infrared systems, RF devices in mobile phones and solar panels in spacecraft. Observing the growth of GaAs nanowires could lead to a better unde... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 09 Feb, 2018 - Comments: 0

Chipmakers China has struck again, as the nation continues to acquire semiconductor technology. In December, Silicon Labs announced plans to acquire Sigma Designs for $282 million. The deal involves Sigma’s Z-Wave chip business. Now, Sigma Designs has sold its connectivity chip business unit to Integrated Silicon Solution Inc. (ISSI). In 2015, a Chinese consortium of investors led by Uph... » read more

Manufacturing Bits: Feb. 6
By Mark LaPedus - 06 Feb, 2018 - Comments: 0

GaN trusted foundry HRL Laboratories--an R&D venture between Boeing and General Motors--has launched a new foundry service for use in advanced millimeter-wave (mmWave) gallium-nitride (GaN) technology applications. HRL’s process, called T3-GaN, is a high-electron-mobility transistor technology. It will enable the fabrication of GaN-based monolithic microwave integrated circuits (MMICs... » read more

Fan-Out Wars Begin
By Mark LaPedus - 05 Feb, 2018 - Comments: 3

Several packaging houses are developing the next wave of high-density fan-out packages for premium smartphones, but perhaps a bigger battle is brewing in the lower density fan-out arena. Amkor, ASE, STATS ChipPAC and others sell traditional low-density fan-out packages, although some new and competitive technologies are beginning to appear in the market. Low-density fan-out, or sometimes cal... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 02 Feb, 2018 - Comments: 0

Fab tools SEMI has announced an urgent call to action to overcome the pressing semiconductor industry challenge of recruiting new talent. In a letter to the CEOs of more than 2,000 global SEMI member companies, Ajit Manocha, SEMI’s president and CEO, called on the executives to act together to attract workers and develop the workforce vital to industry growth. In addition, it is a turbu... » read more

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