Author's Latest Posts

Mapping and Routing Fault-Tolerant Quantum Circuits Onto Chiplet Architectures (TU Munich)
By Technical Paper Link - 28 Apr, 2026 - Comments: 0

A new technical paper, "Chipmunq: A Fault-Tolerant Compiler for Chiplet Quantum Architectures," was published by researchers at the Technical University of Munich. Abstract "As quantum computing advances toward fault-tolerance through quantum error correction, modular chiplet architectures have emerged to provide the massive qubit counts required while overcoming fabrication limits of mon... » read more

Leveraging Agentic AI Techniques to Improve Formal Verification (Infineon, et al.)
By Technical Paper Link - 28 Apr, 2026 - Comments: 0

A new technical paper, "Agentic AI-based Coverage Closure for Formal Verification," was published by researchers at Infineon and the NIT Jalandhar. Abstract "Coverage closure is a critical requirement in Integrated Chip (IC) development process and key metric for verification sign-off. However, traditional exhaustive approaches often fail to achieve full coverage within project timelines.... » read more

Reflectometry-Based Technique for Characterising Complex Thin-Film Structures (Aalto U. et al.)
By Technical Paper Link - 28 Apr, 2026 - Comments: 0

A new technical paper, "Characterisation of Complex Multilayer Nanostructures with High Aspect Ratio," was recent published by researchers at Aalto University, University of Eastern Finland, Chipmetrics OY, and VTT MIKES. Abstract "Deposition studies of deep vertical dips on semiconductor wafers can create problems at an industrial manufacturing scale, since cross-sectioning requires a lo... » read more

Emulation-based SoC Security Verification (U. of Florida)
By Technical Paper Link - 17 Apr, 2026 - Comments: 0

A new technical paper, "Emulation-based System-on-Chip Security Verification: Challenges and Opportunities," was published by researchers at University of Florida. Abstract "Increasing system-on-chip (SoC) heterogeneity, deep hardware/software integration, and the proliferation of third-party intellectual property (IP) have brought security validation to the forefront of semiconductor desig... » read more

GPU Rowhammer Attacks Beyond Data Corruption (U. of Toronto)
By Technical Paper Link - 13 Apr, 2026 - Comments: 0

A new technical paper, "GPUBreach: Privilege Escalation Attacks via GPU Rowhammer," was published by researchers at University of Toronto. Summary "GPUBreach shows that GPU Rowhammer attacks can move beyond data corruption to real privilege escalation. By corrupting GPU page tables, an unprivileged CUDA kernel can gain arbitrary GPU memory read/write, and then chain that capability into CPU... » read more

Silent Data Corruption: A Major Reliability Challenge in Large-Scale LLM Training (TU Berlin)
By Technical Paper Link - 12 Apr, 2026 - Comments: 0

A new technical paper, "Exploring Silent Data Corruption as a Reliability Challenge in LLM Training," was published by researchers at Technische Universitat Berlin. Abstract "As Large Language Models (LLMs) scale in size and complexity, the consequences of failures during training become increasingly severe. A major challenge arises from Silent Data Corruption (SDC): hardware-induced faults... » read more

An Engineering Roadmap Toward Completely Neural Computers (Meta AI, KAUST)
By Technical Paper Link - 11 Apr, 2026 - Comments: 0

A new technical paper, "Neural Computers," was published by researchers at Meta AI and KAUST. Abstract "We propose a new frontier: Neural Computers (NCs) -- an emerging machine form that unifies computation, memory, and I/O in a learned runtime state. Unlike conventional computers, which execute explicit programs, agents, which act over external execution environments, and world models, w... » read more

Study of EUV Nanostructures Using AFM With High-Aspect Ratio Tip (Purdue, Intel, Bruker)
By Technical Paper Link - 11 Apr, 2026 - Comments: 0

A new technical paper, "Characterizing tip-sample interaction dynamics on extreme ultraviolet nanostructures using atomic force microscopy with a high-aspect ratio tip," was released by researchers at Purdue University, Intel Corporation and Bruker Corporation. Abstract "Accurate measurements of the nanometer scale geometry of extreme ultraviolet (EUV) lithography photoresist patterns are... » read more

Photonic Packaging Resistant to Extreme Environments (NIST, Johns Hopkins, U. Of Maryland)
By Technical Paper Link - 11 Apr, 2026 - Comments: 0

A new technical paper, "Photonic chip packaging for extreme environments" was published by NIST, Johns Hopkins and University of Maryland. Abstract "Integrated photonic sensors have advanced significantly in the past decade for an ever-increasing range of applications, driven by the inherent scalability of integrated photonics combined with the precision of nanofabrication. Robust and rug... » read more

Impact of Surface States And Band Modulations in Ruthenium Interconnects (Incheon, Hanyang, UT Dallas)
By Technical Paper Link - 11 Apr, 2026 - Comments: 0

A new technical paper, "Role of surface states and band modulations in ultrathin ruthenium interconnects," was published by researchers at Incheon National University, Hanyang University and UT Dallas. Abstract "Mitigating the RC delay from transistor miniaturization is essential for next-generation devices, driving a focus on interconnect electrical performance. Current copper-based inte... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy