Investigation and Methods Using Various Release and Thermoplastic Bonding Materials to Reduce Die Shift and Wafer Warpage for eWLB Chip-First Processes

By Brewer Science - 14 Aug, 2019 - Comments: 0

Today's fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to achieve lower profile packages without using an inorganic substrate to produce chip packages that are thinner and faster without the need for interposers or through-silicon-vias (TSVs). One approa... » read more

High Voltage Applications.

By UMC - 14 Aug, 2019 - Comments: 0

Today’s high-resolution displays and high data transmission speed have been driving the rapidly growing embedded high voltage (eHV) IC market. UMC supports these applications with extensive and proven eHV technologies, while continuing to invest in research and development to provide more and better solutions to meet current and future requirements for the ever-expanding eHV market. Click... » read more

Reliability Comparison of 28 V – 50 V GaN-on-SiC S-Band and X-Band Technologies

By Wolfspeed, a Cree Company - 14 Aug, 2019 - Comments: 0

This paper discusses the reliability performance of Wolfspeed GaN/AlGaN high electron mobility transistor (HEMT) MMIC released process technologies, fabricated on 100 mm high purity semi-insulating (HPSI) 4H-SiC substrates. The intrinsic reliability performance of the 28 V and 40 V technologies, with 400 nm and 250 nm gate length, has been characterized with DC accelerated life test (DC-ALT), f... » read more

Power Modeling Standard Released

By Brian Bailey - 14 Aug, 2019 - Comments: 0

Power is becoming a more important aspect of semiconductor design, but without an industry standard for power models, adoption is likely to be slow and fragmented. That is why Si2 and the IEEE decided to do something about it. Back in 2014, the IEEE expanded its interest in power standards with the creation of two new groups IEEE P2415 - Standard for Unified Hardware Abstraction and Layer fo... » read more

Blog Review: Aug. 14

By Jesse Allen - 14 Aug, 2019 - Comments: 0

Cadence's Paul McLellan digs into Mary Meeker's analysis of Internet trends, from growth of the Inernet as a whole to cyber attacks, online finance, and the gig economy. Synopsys' Taylor Armerding warns that the financial services industry is aware of cybersecurity threats, but isn't doing enough to protect its networks and data. Mentor's Colin Walls considers a few cases where writing in... » read more

Manufacturing Bits: Aug. 13

By Mark LaPedus - 13 Aug, 2019 - Comments: 0

Exascale supercomputers The Department of Energy’s National Nuclear Security Administration (DOE/NNSA) has signed a contract valued at $600 million with Cray to build NNSA’s first exascale supercomputer. The system, called El Capitan, is expected to be shipped in late 2022. El Capitan will be housed at Lawrence Livermore National Laboratory (LLNL), and will perform research to maintain ... » read more

Power/Performance Bits: Aug. 13

By Jesse Allen - 13 Aug, 2019 - Comments: 0

Smartphone virus scanner Scientists at the University of Tokyo built a new type of virus scanner for smartphones: to detect diseases, not malware. The handheld, portable device uses a smartphone to help scan biological samples for influenza virus. The virus scanner is about the size of a brick, with a slot to position a smartphone such that its camera looks through a lens. Inside the device... » read more

System Bits: Aug. 13

By Jeff Dorsch - 13 Aug, 2019 - Comments: 0

Keeping tabs on crops University of Missouri researchers collaborated with the Agricultural Research Service at the U.S. Department of Agriculture on pairing a regular digital camera with a miniature infrared camera for a novel system providing temperature data and detailed images of crops. “Using an infrared camera to monitor crop temperature can be tricky because it is difficult to diff... » read more

U.S. Consortium Pulls Ecosystem Into Quantum

By SE Staff - 12 Aug, 2019 - Comments: 0

Quantum computing promises to solve impossibly complex problems that no classical computer could solve, and do it in a humanly reasonable amount of time. The hitch is that quantum computers are still in the early development phase. Whether these computers can fulfill that promise is not yet known. Despite the uncertainty, no one wants to be left behind. That includes governments, which are w... » read more

Debug Tools Are Improving

By Brian Bailey - 12 Aug, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss debugging complex SoCs with Randy Fish, vice president of strategic accounts and partnerships for UltraSoC; Larry Melling, product management director for Cadence; Mark Olen, senior product marketing manager for Mentor, a Siemens Business; and Dominik Strasser, vice president of engineering for OneSpin Solutions. Part one can be found here. Part two... » read more

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