Raising The Bar In Mission-Critical Verification


The 2024 Siemens EDA and Wilson Research Group Functional Verification Study provides an in-depth analysis of current trends in FPGA design and verification, with a particular focus on the aerospace and defense (A&D) sector. The study highlights the increasing complexity of FPGA designs driven by factors such as embedded processors, asynchronous clock domains, and stringent security and saf... » read more

Countering Security Threats Of Quantum Attacks With PSOC Control Microcontrollers


Quantum computers of appropriate power are expected to break traditional public-key encryption such as ECC and RSA. Quantum computers that will be able to mount attacks on public-key cryptography are commonly referred to as 'Cryptographically Relevant Quantum Computers’ (CRQCs). Betting on the future existence of CRQCs, attackers may also harvest encrypted data today and to decrypt it later o... » read more

Today’s Screen Culture Puts Higher Pressure On Display Chips


Just as cathode ray tube technology has been relegated to specialist industrial and medical settings, OLED (organic light-emitting diode) is overtaking LCD (liquid crystal display) in some applications due to its superior image quality and contrast. But OLED is not a one-size-fits-all. An array of new technologies is being developed to meet consumer demand for better, brighter screens with h... » read more

ADAS/AD: Why An External Safety MCU Remains A Cornerstone For Safety Alongside SoC Safety Islands


Advanced driver-assistance systems (ADAS) and autonomous driving (AD) technologies are revolutionizing mobility, making vehicles smarter, safer, and increasingly autonomous. At the heart of these advancements are sophisticated computing architectures built on system-on-chips (SoCs) that manage complex tasks like perception, decision-making, and control. Many SoCs integrate a "Safety Island"—a... » read more

Rethinking Automotive Development: Virtualization for the Software-Defined Era


Stay competitive in the new era of software-defined vehicles. This guide reveals how virtualization enables automotive leaders to: Accelerate development and innovation Unlock cost savings and reduce delays Overcome legacy challenges and adapt to CASE (Connected, Autonomous, Shared, Electric) trends Streamline R&D and integration processes Who should read this guide? ... » read more

New Approaches To Limit Cyberattacks On Hardware


The number and value of cyberattacks on semiconductors is rising, but new approaches to designing and packaging chips could put a significant dent in those figures. Semiconductor-related cybersecurity attacks have multiplied more than six times since 2022, according to a report by cyber intelligence firm CloudSEK. These attacks have cost the semiconductor industry an estimated $1.05 billion ... » read more

How Grinn And Synaptics Are Accelerating Edge AI Adoption And Innovation


From smart cities to industrial automation, organizations are rethinking how and where data is processed. The answer, increasingly, is at the Edge—where devices can analyze information in real time without sending it to the cloud. This approach improves responsiveness, enhances security, and reduces reliance on network connectivity. Recognizing this shift, Grinn Global and Synaptics have p... » read more

GPU Driver Update Adds Support For Additional Vulkan And OpenCL Extensions


Here are some of the highlights of what has been updated in the latest Imagination GPU Linux and Android Driver Development Kits: Leveraging cooperative matrix in Vulkan To help accelerate graphics post-processing, neural shaders, physics simulations, and machine learning inference on the GPU, DDK 25.2 implements support for VK_KHR_cooperative_matrix. This extension provides Vulkan developers... » read more

Monolithic Integration of Air-Clad Optical Through-Silicon Waveguides in Silicon (TH Wildau et al.)


A new technical paper titled "Monolithically Integrated Optical Through-Silicon Waveguides for 3D Chip-to-Chip Photonic Interconnects" was published by researchers at the Technical University of Applied Sciences Wildau, TU of Applied Sciences Mittelhessen, TU Ilmenau, Brandenburg University of Technology and Fraunhofer IPMS. Abstract "The scaling limitations of electrical interconnects are ... » read more

Wafer Warpage Evolution During Key Backside Power Delivery Network Fabrication Steps (Korea Univ., Georgia Tech)


A new technical paper titled "Process-Induced Warpage Behavior in Backside Power Delivery Network Fabrication" was published by researchers at Korea University and Georgia Institute of Technology. Abstract "As semiconductor devices continue to scale, backside power delivery networks (BSPDNs) have emerged as a promising alternative to conventional front-side power delivery networks (FSPDNs),... » read more

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