Crisis Ahead: Power Consumption In AI Data Centers
By Ed Sperling - 21 Jul, 2025 - Comments: 2

AI data centers are consuming energy at roughly four times the rate that more electricity is being added to grids, setting the stage for fundamental shifts in where power is generated, where AI data centers are built, and much more efficient system, chip, and software architectures. The numbers are particularly striking for the United States and China, which are in a race to ramp up AI data ... » read more

Chip Industry Week in Review
By The SE Staff - 18 Jul, 2025 - Comments: 0

The U.S. government will grant licenses to NVIDIA and AMD to again sell some AI chips — NVIDIA's H20 GPU and AMD's MI308 — to Chinese companies. TrendForce projects that the availability of NVIDIA chips, in particular, will create a surge in demand from Chinese AI firms and cloud service providers, and boost high-bandwidth memory (HBM) consumption. The move could raise China’s share of... » read more

Transformers At The Edge: Efficient LLM Deployment
By Paul Karazuba - 17 Jul, 2025 - Comments: 0

Since the groundbreaking 2017 publication of “Attention Is All You Need,” the transformer architecture has fundamentally reshaped artificial intelligence research and development. This innovation laid the foundation for Large Language Models (LLMs) and Video Language Models (VLMs), fueling a wave of productization across the industry. A defining milestone was the public launch of ChatGPT in... » read more

Do We Have Enough Standards For An Open-Chiplet Ecosystem?
By Andy Heinig - 17 Jul, 2025 - Comments: 0

For some time now, the semiconductor industry has been discussing the development of an open chiplet ecosystem. The idea is that, rather than having monolithic systems on a chip, it should be possible to combine smaller, specialized chiplets in a modular way – ideally across different manufacturers. Doing so would promise great flexibility with much shorter development times, resulting in muc... » read more

RTL Signoff vs. Functional Signoff: What’s The Difference?
By Bradley Geden - 17 Jul, 2025 - Comments: 1

By Bradley Geden and Manoz Palaparthi In semiconductor design, “signoff” is often treated as a single milestone. In practice, however, it encompasses distinct verification phases with unique objectives. Functional signoff and RTL signoff represent two such phases. Both are essential, and each one is focused on different facets of correctness. While functional signoff verifies whether ... » read more

Scaling In The AI Era: The Role Of PCI Express 7.0 Switches In Next-Gen Data Centers
By Lou Ternullo - 17 Jul, 2025 - Comments: 0

As artificial intelligence (AI) workloads continue to scale in complexity and volume, the infrastructure that supports them must evolve just as rapidly. At the heart of this transformation lies PCI Express 7.0 (PCIe 7.0), a next-generation interconnect standard that is redefining how data moves within high-performance computing (HPC) and AI-driven data centers. PCIe 7.0 doubles the raw bit r... » read more

That’s Not A DSP!
By Steve Roddy - 17 Jul, 2025 - Comments: 0

In the 1986 hit comedy movie "Crocodile Dundee," the title character – a rough and tumble Australian transported to the mean streets of New York City – is confronted by street thugs brandishing a switchblade knife who demand his wallet. In response he cooly smirks and pulls a knife out of his belt that is 10 times the size of the would-be assailants’ weapon and delivers the signature line... » read more

A Better Path To Better 3D-IC Thermal Modeling
By Andras Vass-Varnai - 17 Jul, 2025 - Comments: 0

By Andras Vass-Varnai, Lee Wang, John Parry, Byron Blackmore, and Sudarshan Deo In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of semiconductor technology, the thermal management of 2.5D and 3D integrated circuits has become a make-or-break factor in product success. The traditional approach of treating thermal analysis as an ... » read more

Designing The AI Factories: Unlocking Innovation With Intelligent IP
By Reela Samuel - 17 Jul, 2025 - Comments: 0

The rapid evolution of artificial intelligence (AI) is reshaping the technological landscape, driving unprecedented demands on computing infrastructure. At the heart of this transformation lie innovations in intellectual property (IP) that enable scalable, efficient, and performance-driven AI factories. These advancements are central to addressing the technical challenges of modern AI workloads... » read more

Can Today’s Processor Architectures Be More Efficient?
By Bryon Moyer - 17 Jul, 2025 - Comments: 3

For years, processors focused on performance, and that performance had little accountability to anything else. Performance still matters, but now it must be accountable to power. If small gains in performance result in disproportionate power gains, designers may need to discard such improvements in favor of more power-efficient ones. Although current architectures undergo a steady cadence of... » read more

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