From Data To Decisions: Exploring Enterprise Digital Thread Strategy And Simulation
By Sanjay Angadi - 17 Jul, 2025 - Comments: 0

By Sanjay Angadi and Matteo Nicolich It’s nice to think that “aha” moments come out of nowhere — that the next big thing is the result of unbridled genius (or plain dumb luck). But in reality, effective, sustainable product development rarely arises from a solitary flash of brilliance. Innovation requires information, context, collaboration, experimentation, and even failure. Usin... » read more

Often Overlooked, PHYs Are Essential To High-Speed Data Movement
By Ann Mutschler - 17 Jul, 2025 - Comments: 0

Over the past couple of decades, the semiconductor industry has evolved from a supporting role for traditional verticals like mobile, automotive, and PCs to a foundational role in those markets, as well as in AI factories and hyperscale data centers. Underlying this transformation is the physical layer (PHY), which has emerged as a critical enabler for data transfer and communications. The P... » read more

Scaling Real-Time Visitor Ingestion And ML Inference
By Peter Ma - 17 Jul, 2025 - Comments: 0

When SiteMana onboarded a large new publisher, our infrastructure load increased exponentially overnight. Each visitor page view flowed directly into our real-time ingestion pipeline. This rapid traffic caused CPU credits to quickly exhaust on our AWS x86-based t3.medium instances. As a result, performance was throttled at the exact moment we needed stability most. We quickly realized our syste... » read more

When Can I Buy A Chiplet?
By Brian Bailey - 17 Jul, 2025 - Comments: 1

One year ago, Semiconductor Engineering conducted its first roundtable to find out the true state of the industry for chiplets. At that event, it was stated that no chiplet had ever been reused in a design for which it was not initially intended. How much has changed over the past year? Returning from last year were Mark Kuemerle, vice president of technology for Marvell; Letizia Giuliano, vice... » read more

Finding And Fixing Leakage Between Power Domains
By Siemens EDA - 17 Jul, 2025 - Comments: 0

While there are many forms of current leakage in semiconductors, one especially nefarious type of leakage happens between power rails or power domains. Finding inter-domain leakage is vitally important for design reliability, especially in mixed power system design, but it is a known weakness of traditional electronic design automation (EDA) tools. Specialized EDA tools are needed to accurately... » read more

Rowhammer Attack On NVIDIA GPUs With GDDR6 DRAM (University of Toronto)
By Technical Paper Link - 16 Jul, 2025 - Comments: 0

A new technical paper titled "GPUHammer: Rowhammer Attacks on GPU Memories are Practical" was published by researchers at University of Toronto. Abstract: "Rowhammer is a read disturbance vulnerability in modern DRAM that causes bit-flips, compromising security and reliability. While extensively studied on Intel and AMD CPUs with DDR and LPDDR memories, its impact on GPUs using GDDR memorie... » read more

Silent Data Corruption
By Ed Sperling - 16 Jul, 2025 - Comments: 0

Everyone expects their compute systems to generate the correct answer. When they don't, it's cause for alarm, because it's not always clear how long the problem has persisted. Even worse, chips and systems are now so complex that it may require a unique sequence of operations to trigger a silent data error, and they may show up only occasionally, and maybe only after months or years of use in t... » read more

Examination Of Thermal Issues Related to Hybrid Bonding of 3D-Stacked HBM
By Technical Paper Link - 16 Jul, 2025 - Comments: 0

A new technical paper titled "Thermal Issues Related to Hybrid Bonding of 3D-Stacked High Bandwidth Memory: A Comprehensive Review" was published by researchers at Chungbuk National University. Abstract "High-Bandwidth Memory (HBM) enables the bandwidth required by modern AI and high-performance computing, yet its three dimensional stack traps heat and amplifies thermo mechanical stress. We... » read more

Exploring The Latest Innovations In MIPI D-PHY And MIPI C-PHY
By Mixel - 16 Jul, 2025 - Comments: 0

Introduction  In the ever-evolving landscape of high-performance camera and display technologies, MIPI D-PHY™ and MIPI C-PHY™ specifications continue to lead the charge, setting benchmarks for low power, low latency, and high bandwidth data transmission. Building on the insights from our previous article, “Demystifying MIPI C-PHY/D–PHY Subsystem” – ... » read more

EBook: Optimizing Analog Design With Multiphysics
By Ansys - 16 Jul, 2025 - Comments: 0

As technologies like artificial intelligence (AI), 5G, electric vehicles, and high-speed computing continue to advance, analog and mixed-signal (AMS) technologies have become the unsung heroes of next-gen electronics. AMS chips are enabling smarter, faster, and more efficient systems, but traditional design approaches are struggling to keep pace. Interconnect parasitics, power integrity, photo... » read more

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