Innovation And Collaboration In Power Module Packaging: A Thermal Perspective

By Thomas Wang - 17 Apr, 2025 - Comments: 0

Power modules are the foundation of modern electrical systems, especially within electric vehicles (xEVs), industrial motor applications, and renewable energy solutions such as wind and solar power. As the demand for more power in smaller and lighter systems grows, managing heat dissipation has become a major challenge, as the thermal energy from high current flows can lead to reliability issue... » read more

Fine-Line RDL Structure Analysis of Fan-Out Chip-on-Substrate Platform

By ASE - 17 Apr, 2025 - Comments: 0

Abstract: "The demand for high bandwidth memory (HBM) has driven the need for advanced packaging solutions, particularly those involving fan-out layers to interconnect wafers within packages. To meet the high-bandwidth requirements of the Fan-Out Chip-on-Substrate (FOCoS) technology platform, additional layers are required. However, as the number of fanout layers increases, significant chall... » read more

Backside Power Delivery Nears Production

By Laura Peters - 17 Apr, 2025 - Comments: 0

Backside power delivery is being called a game changer — a breakthrough technology and the next great enabler in CMOS scaling. It promises significant PPA advances, including faster switching, lower voltage droop, and reduced power supply noise. And it is poised to deliver these benefits below the 2nm node, despite a substantial disruption in front-end processes from lithography pattern di... » read more

Packaging With Fewer People And Better Results

By Gregory Haley - 17 Apr, 2025 - Comments: 1

Advanced packaging has evolved far beyond the simple stacking of dies and connecting of interposers. Once a passive conduit between silicon and the outside world, it has become an active component of overall device performance. In today’s multi-die assemblies, the assembly and packaging lines are expected to maintain signal integrity at multi-gigahertz frequencies, manage heat in verticall... » read more

Advanced Atomistic Simulation Techniques For Atomic Layer Etching

By Synopsys - 17 Apr, 2025 - Comments: 0

Continuous downscaling of the critical dimensions in semiconductor devices is the cornerstone of technological revolution. As the technology nodes keep shrinking, innovations in fabrication technologies are needed to continue the trend. We have arrived at the age where atomic level precision in the fabrication of semiconductor devices is needed to keep improving PPA. Thus, advanced film fabrica... » read more

What’s Changing In SerDes

By Ed Sperling - 16 Apr, 2025 - Comments: 0

SerDes is all about pushing data through the smallest number of physical channels. But when it comes to AI, more data needs to be moved, and it has to be moved more quickly. Todd Bermensolo, product marketing manager at Alphawave Semi, talks about the impact of faster data movement on the transmitter (more power) and on the receiver (gain and advanced equalization), how to ensure signal inte... » read more

Blog Review: Apr. 16

By Jesse Allen - 16 Apr, 2025 - Comments: 0

Siemens’ Tova Levy finds that heterogeneous integration necessitates a shift to a system-level technology co-optimization approach where power, performance, area, cost, and reliability are considered across various components, including silicon, package, interposer, and PCB. Synopsys’ Greg Sorber listens in as Arm’s Rene Haas and Synopsys’ Sassine Ghazi discuss the opportunity for AI... » read more

AI Agents Need Goals

By Brian Bailey - 16 Apr, 2025 - Comments: 0

Experts At The Table: Definitions and goals matter when it comes to using AI effectively, and it has to be tightly reined in to be effective. Semiconductor Engineering sat down with a panel of experts to discuss these issues and others, including Johannes Stahl, senior director of product line management for the Systems Design Group at Synopsys; Michael Young, director of product marketing for ... » read more

Single Transistor Memory Cell C2RAM Based On FDSOI For Quantum And Neuromorphic

By Technical Paper Link - 15 Apr, 2025 - Comments: 0

A new technical paper titled "An Energy Efficient Memory Cell for Quantum and Neuromorphic Computing at Low Temperatures" was published by researchers at Forschungszentrum Jülich, RWTH Aachen University and SOITEC. Abstract: "Efficient computing in cryogenic environments, including classical von Neumann, quantum, and neuromorphic systems, is poised to transform big data processing. The que... » read more

Three Ways Curvy ILT Together With PLDC Improves Wafer Uniformity

By Aki Fujimura - 15 Apr, 2025 - Comments: 0

This is the second blog in a three-part series on pixel-level dose correction (PLDC). The first installment was “Improving Uniformity and Linearity for All Masks” from January 29, 2025. PLDC: A new solution for improving mask and wafer uniformity Improving mask uniformity is the easiest, cheapest way to improve wafer uniformity. Uniformity is a measure of how similarly the exact same feat... » read more

← Older posts Newer posts →