Chip Industry’s Technical Paper Roundup: Dec 11
By Liz Allan - 11 Dec, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=174 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review
By The SE Staff - 08 Dec, 2023 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan AMD took the covers off new AI accelerators for training and inferencing of large language model and high-performance computing workloads. In its announcement, AMD focused heavily on performance leadership in the commercial AI processor space through a combination of architectural changes, better software efficiency, along with some improvements in... » read more

Security Becoming Core Part Of Chip Design — Finally
By Ann Mutschler - 07 Dec, 2023 - Comments: 1

Security is shifting both left and right in the design flow as chipmakers wrestle with how to build devices that are both secure by design and resilient enough to remain secure throughout their lifetimes. As increasingly complex devices are connected to the internet and to each other, IP vendors, chipmakers, and systems companies are racing to address existing and potential threats across a ... » read more

Auto Network Speeds Rise As Carmakers Prep For Autonomy
By John Koon - 07 Dec, 2023 - Comments: 0

In-vehicle networks are starting to migrate from domain architectures to zonal architectures, an approach that will simplify and speed up communication in a vehicle using fewer protocols, less wiring, and ultimately lower cost. Zonal architectures will partition vehicles into zones that are more manageable and flexible, but getting there will take time. There is so much legacy technology in ... » read more

Why Are Automotive SoC Designers Turning To PCI Express 6.0?
By Richard Solomon - 07 Dec, 2023 - Comments: 0

Just over two decades ago, the introduction of PCI Express 1.0 marked the industry’s transition from then-ubiquitous parallel to serial interfaces. Back in 2002, the potential of “PCIe” in automotive applications was unforeseen – given the then-current state of in-vehicle computation and PCIe’s primary focus on desktop and data center use. Today, however, with the advent of connected ... » read more

AI Races To The Edge
By Karen Heyman - 07 Dec, 2023 - Comments: 0

AI is becoming increasingly sophisticated and pervasive at the edge, pushing into new application areas and even taking on some of the algorithm training that has been done almost exclusively in large data centers using massive sets of data. There are several key changes behind this shift. The first involves new chip architectures that are focused on processing, moving, and storing data more... » read more

The Evolution Of Generative AI Up To The Model-Driven Era
By Steve Brown - 07 Dec, 2023 - Comments: 0

Generative AI has become a buzzword in 2023 with the explosive proliferation of ChatGPT and large language models (LLMs). This brought about a debate about which is trained on the largest number of parameters. It also expanded awareness of the broader training of models for specific applications. Therefore, it is unsurprising that an association has developed between the term “Generative AI�... » read more

Getting Ready For The Quantum Computing Era: Thoughts On Hybrid Cryptography
By Bart Stevens - 07 Dec, 2023 - Comments: 0

Once quantum computers, more specifically Cryptographically Relevant Quantum Computers (CRQCs), have become powerful and reliable enough, they will enable adversaries to break current asymmetric encryption, placing important data and assets at risk. New digital signatures and key encapsulation mechanisms (KEMs) are needed, and while considerable progress has been made in recent years to develop... » read more

Semiconductor Device Manufacturing Process Challenges And Opportunities
By Andreas Bier - 07 Dec, 2023 - Comments: 0

Semiconductor device manufacturing involves a complex series of processes that transform raw materials into finished devices. The process typically involves four major stages: wafer fabrication, wafer testing, assembly or packaging, and final testing. Each stage has its own unique set of challenges and opportunities. The semiconductor device manufacturing process faces several challenges, inclu... » read more

Advanced DFT And Silicon Bring-Up For AI Chips
By Lee Harrison - 07 Dec, 2023 - Comments: 0

The AI market is growing quickly, spurring an insatiable demand for powerful AI accelerators. AI chip makers are pressed with aggressive time-to-market goals and need the tools to help them get their chips into the hands of customers as quickly as possible. IC test and silicon bring-up are tasks that can affect both the quality and the time-to-market of AI chips. Different companies are usin... » read more

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