Parallel Circuit Execution & NISQ Computing
By Technical Paper Link - 02 May, 2022 - Comments: 0

Research from LIRMM, University of Montpellier, CNRS. Abstract "Quantum computing is performed on Noisy Intermediate-Scale Quantum (NISQ) hardware in the short term. Only small circuits can be executed reliably on a quantum machine due to the unavoidable noisy quantum operations on NISQ devices, leading to the under-utilization of hardware resources. With the growing demand to access quan... » read more

AI-Based Method to Prune the Design Space of Heterogeneous NoCs
By Technical Paper Link - 02 May, 2022 - Comments: 0

Abstract "Often suffering from under-optimization, Networks-on-Chip (NoCs) heavily impact the efficiency of domain-specific Systems-on-Chip. To cope with this issue, heterogeneous NoCs are promising alternatives. Nevertheless, the design of optimized NoCs satisfying multiple performance objectives is extremely challenging and requires significant expertise. Prior works failed to combine many... » read more

Vertically stacked, low-voltage organic ternary logic circuits including nonvolatile floating-gate memory transistors
By Technical Paper Link - 02 May, 2022 - Comments: 0

Research paper from KAIST and Gachon University. Abstract "Multi-valued logic (MVL) circuits based on heterojunction transistor (HTR) have emerged as an effective strategy for high-density information processing without increasing the circuit complexity. Herein, an organic ternary logic inverter (T-inverter) is demonstrated, where a nonvolatile floating-gate flash memory is employed to ... » read more

Analog Edge Inference with ReRAM
By Technical Paper Link - 02 May, 2022 - Comments: 0

Abstract "As the demands of big data applications and deep learning continue to rise, the industry is increasingly looking to artificial intelligence (AI) accelerators. Analog in-memory computing (AiMC) with emerging nonvolatile devices enable good hardware solutions, due to its high energy efficiency in accelerating the multiply-and-accumulation (MAC) operation. Herein, an Applied Materials... » read more

CEO Outlook: Chip Industry 2022
By Ed Sperling - 02 May, 2022 - Comments: 0

Semiconductor Engineering sat down to discuss broad industry changes and how that affects chip design with Anirudh Devgan, president and CEO of Cadence; Joseph Sawicki, executive vice president of Siemens EDA; Niels Faché, vice president and general manager at Keysight; Simon Segars, advisor at Arm; and Aki Fujimura, chairman and CEO of D2S. This discussion was held in front of a live audience... » read more

Chipping In For Equipment Suppliers: The Equipment Multiplier Effect On The Chip Shortage
By Ajit Manocha - 02 May, 2022 - Comments: 0

By Ajit Manocha and Sanjay Malhotra Global semiconductor supply imbalances have hindered countless industries including essential segments such as automotive and medical as well as workers and consumers. Around the world, policymakers are increasing semiconductor manufacturing capacity to strengthen supply chains and meet growing demand for semiconductors through robust incentive packages to... » read more

HD Map (EdgeMap) Crowdsources Data From Connected Vehicles in Auto Edge Computing
By Technical Paper Link - 30 Apr, 2022 - Comments: 0

New research paper from University of Nebraska-Lincoln, Xidian University and University of North Carolina at Charlotte. Abstract "High definition (HD) map needs to be updated frequently to capture road changes, which is constrained by limited specialized collection vehicles. To maintain an up-to-date map, we explore crowdsourcing data from connected vehicles. Updating the map collaborati... » read more

Die-level Thinning and Integrating Route For Singulated MPW Chips Using Both Silicon Sensors and CMOS Devices
By Technical Paper Link - 30 Apr, 2022 - Comments: 0

Abstract "Die-level thinning, handling, and integration of singulated dies from multi-project wafers (MPW) are often used in research, early-stage development, and prototyping of flexible devices. There is a high demand for thin silicon devices for several applications, such as flexible electronics. To address this demand, we study a novel post-processing method on two silicon devices, an el... » read more

Image Sensor Trained To Classify Optically Projected Images By Reading Out The Few Most Relevant Pixels
By Technical Paper Link - 30 Apr, 2022 - Comments: 0

New research paper "Sparse pixel image sensor" from Institute of Photonics, Vienna University of Technology. Abstract "As conventional frame-based cameras suffer from high energy consumption and latency, several new types of image sensors have been devised, with some of them exploiting the sparsity of natural images in some transform domain. Instead of sampling the full image, those devices... » read more

A Case for Transparent Reliability in DRAM Systems
By Technical Paper Link - 29 Apr, 2022 - Comments: 0

New technical paper from ETH Zurich and TU Delft. Abstract "Today's systems have diverse needs that are difficult to address using one-size-fits-all commodity DRAM. Unfortunately, although system designers can theoretically adapt commodity DRAM chips to meet their particular design goals (e.g., by reducing access timings to improve performance, implementing system-level RowHammer mitigati... » read more

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