Using Digital Twins And DL In Lithography

By Ed Sperling - 21 Nov, 2019 - Comments: 0

Leo Pang, chief product officer and executive vice president at D2S, looks at the results of inverse lithography technology at advanced nodes using curvilinear patterns, and how that can be combined with a digital twin and deep learning speed up time to market and reduce cost. » read more

Foldable Phones Bend The Limits Of Technology

By Applied Materials - 21 Nov, 2019 - Comments: 0

After years of discussion about flexible, bendable displays for mobile electronic devices, the first and most logical of these devices, foldable phones, will hit the market this year — along with some as yet unresolved issues and challenges. Early adopters welcome the introduction of such exciting new technologies (figure 1). But from a broad industry standpoint, which mobile phone designs wi... » read more

Blog Review: Nov. 20

By Jesse Allen - 20 Nov, 2019 - Comments: 0

Arm's Ben Fletcher points to research into a new low-cost alternative to through-silicon vias in 3D stacked ICs, particularly cost-sensitive IoT designs, where communication between silicon layers is completely wireless. Cadence's Paul McLellan checks in on the progress of DARPA's OpenROAD project to build a no-human-in-the-loop open source EDA flow for leading-edge nodes. Mentor's Colin ... » read more

Why Standard Memory Choices Are So Confusing

By Ann Mutschler - 19 Nov, 2019 - Comments: 0

System architects increasingly are developing custom memory architectures based upon specific use cases, adding to the complexity of the design process even though the basic memory building blocks have been around for more than half a century. The number of tradeoffs has skyrocketed along with the volume of data. Memory bandwidth is now a gating factor for applications, and traditional memor... » read more

Manufacturing Bits: Nov. 19

By Mark LaPedus - 19 Nov, 2019 - Comments: 0

World’s lightest foam Lawrence Livermore National Laboratory (LLNL) has developed what researchers say is the world’s lightest gold foam. LLNL has devised gold aerogel foam. The foam is light enough where it could be carried on the back of tiny insects. Applications for the technology include electronics, catalysis, sensors and energy conversion and storage. An aerogel is based on a ... » read more

Power/Performance Bits: Nov. 19

By Jesse Allen - 19 Nov, 2019 - Comments: 0

Quantum communications chip Researchers at Nanyang Technological University, Australian National University, A∗STAR, University of Science and Technology of China, Singapore University of Technology and Design, Sun Yat-sen University, Beijing University of Posts and Telecommunications, and National University of Singapore built an integrated silicon photonic chip capable of performing quantu... » read more

Making Sense Of Inferencing Options

By Ed Sperling - 19 Nov, 2019 - Comments: 0

Ian Bratt, fellow in Arm’s machine learning group, sheds light on all the different processing elements in machine learning, how different end user requirements affect those choices, why CPUs are a critical element in orchestrating what happens in these systems, and how power and software play into these choices. » read more

Reducing Data At The Source

By Ed Sperling - 18 Nov, 2019 - Comments: 0

Jens Döge, group manager for image acquisition and processing in Fraunhofer IIS’ Engineering of Adaptive Systems Division, talks about how to slash the amount of data that needs to be sent to the cloud or edge for processing by focusing only on the regions of interest in an image, and how that reduces the cost of moving that data. » read more

RISC-V Markets, Security And Growth Prospects

By Ed Sperling - 18 Nov, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss open instruction set hardware with Ben Levine, senior director of product management in Rambus' Security Division; Jerry Ardizzone, vice president of worldwide sales at Codasip; Megan Wachs, vice president of engineering at SiFive; and Rishiyur Nikhil, CTO of Bluespec. What follows are excerpts of that conversation. Part one of this discussion is ... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 15 Nov, 2019 - Comments: 0

Market research Smartphone shipments in China stood at 98.9 million units in the third quarter of 2019, down 3.6% year-on-year, according to IDC. Of that, 5G phone shipments in China have grown from virtually zero not long ago to 485,000 units in the third quarter of 2019, according to IDC. Vendors shipped devices amid the launch of commercial 5G services in October. The early smartphone le... » read more

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