category: Blogs – MD

category: IoT, Security & Automotive

U.S. Tax Reform
By SEMI - 20 Dec, 2016 - Comments: 1

By Jamie Gerard Although SEMI has been working on behalf of its members on reforming the U.S. business tax code for many years, the opportunity to see that change is becoming more likely than any time in the 21st century. President-elect Donald Trump and the Republican majorities in both houses of Congress have signaled that tax reform will be at the top of their agenda as the 115th congres... » read more

5 Takeaways from IEDM
By Mark LaPedus - 15 Dec, 2016 - Comments: 1

As usual, the recent IEEE International Electron Devices Meeting (IEDM) was a busy week. The event, which took place in San Francisco, featured a plethora of subjects, such as next-generation transistors and memories. The event also included tracks on non-traditional approaches like quantum and neuromorphic computing. And then, there were sessions on power semis and others. In no partic... » read more

Using Automated Pattern Matching For SRAM Physical Verification
By Elven Huang - 15 Dec, 2016 - Comments: 0

How often have you struggled to verify static random-access memory (SRAM) blocks in your design? And how often, no matter how much time you spend on them, do they end up causing manufacturing issues? Memory is a critical component in today’s SoC designs, often consuming 50% or more of the die area. SRAM blocks are typically assembled in a layout using a set of specific intellectual propert... » read more

Software Platforms Bridge The Design/Verification Gap For 5G Communications Design
By David Vye - 15 Dec, 2016 - Comments: 0

The integration of simulation technologies, system prototyping tools, and automated test equipment is critical for addressing the complexity of developing 5G wireless technology. In these cases, design teams will need to rely on a combination of simulation and prototype testing in order to ensure design robustness. Although simulation is essential to design a test bed or prototype, measurement... » read more

40nm Technology Reinvigorated
By Steve Sharp - 15 Dec, 2016 - Comments: 0

When selecting a foundry process for mobile consumer focused products, chip designers are considering the economics of the solution just as much as the technical specifications. Using the latest and greatest finFET process might get you performance headroom above your spec, but could cost significantly more than using a more established, proven process. Today’s 40nm CMOS processes have bee... » read more

BEOL Barricades Ahead
By David Fried - 15 Dec, 2016 - Comments: 0

Coventor recently assembled an expert panel at IEDM 2016, to discuss changes to BEOL process technology that would be needed to continue dimensional scaling to 7 nm and lower. Among the questions posed to panelists: What is BEOL? Where does it begin and end? Are there fundamental limits to interconnect processes? How much longer can we continue to use current interconnect processes and ... » read more

Printed Cars, Smart Stints, Personal Breathalyzers
By Joanne Itow - 21 Nov, 2016 - Comments: 0

The MEMS and sensor market continues to be a hotbed for innovation, new opportunities and, as with most new frontiers, there are also some disparate views on market dynamics and strategies. All this was evident at the 2016 MSIG Executive Congress last week in Scottsdale, Arizona. First, I’ll cover the pioneering and fun subjects. In addition to the Technology Showcase demos and member pres... » read more

Changes In China
By SEMI - 21 Nov, 2016 - Comments: 0

By Jesse Zhang, SEMI China Industry leaders gathered in Beijing at BIMS 2016 — the Beijing International Microelectronics Symposium — to discuss growth opportunities for the semiconductor industry and the mobile communications market. The 17th session of BIMS was co-sponsored by SEMI and the Chinese-American Semiconductor Professionals Association (CASPA). For 17 years, BIMS has provi... » read more

Advanced Packaging Requires Better Yield
By Ed Sperling - 17 Nov, 2016 - Comments: 1

Whether Moore's Laws truly ends, or whether the semiconductor industry reaches into the Angstrom world after 3nm—the semiconductor industry dislikes fractions—advanced packaging increasingly will dominate semiconductor designs. Apple already is on board with its iPhone 7, using TSMC's fan-out approach. And all of the major foundries and OSATs are lining up with a long list of capabilitie... » read more

Software Platforms Bridge The Design/Verification Gap For 5G Communications Design
By David Vye - 17 Nov, 2016 - Comments: 0

We are entering the third phase of information connectivity, one that will change the use of wireless technology dramatically. The first phase connected homes and businesses through wired telephony and the early internet via dial-up modems. Over the last few decades, the development of communication networks has been superseded by wireless mobile technology connecting people instead of places. ... » read more

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