category: A System Perspective

category: IoT, Security & Automotive

Why Every Design IP Needs A Complete QA Methodology
By WeiLii Tan - 22 Sep, 2022 - Comments: 0

Design IP is a key contributor to innovation in the semiconductor industry today. As the complexity and scale of silicon designs increase, so does design and verification time. Design IP enables modularization and re-use of design components, so that designers can leverage already-existing components as a baseline to accelerate design schedules. Therefore, it is not surprising that the usage of... » read more

The Complex Art Of Handling S-Parameters
By Pradeep Thiagarajan - 12 Sep, 2022 - Comments: 1

By Pradeep Thiagarajan and Youssef Abdelkader IC design is transforming at an accelerated pace along with fabrication technology. The need to incorporate more functionality has led to denser dies, multi-die chips, stacked 3D ICs, and advanced packaging. Furthermore, the increasing demand for enhanced connectivity with more and faster access to data continues to drive technology towards highe... » read more

Earlier SoC Design Exploration And Verification Gets Better Designs To Tapeout Faster
By Nermeen Hossam - 25 Aug, 2022 - Comments: 0

By Nermeen Hossam and John Ferguson Between the complexity of advanced node design verification and the competition to be first to the market, system-on-chip (SoC) designers no longer have the luxury of waiting until each sub-block of a chip is DRC-clean to start their chip assembly and verification. Today’s SoC designers typically start chip integration in parallel with block development.... » read more

2.5/3D IC Reliability Verification Has Come A Long Way
By Dina Medhat - 01 Aug, 2022 - Comments: 0

2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs have multiple dies placed side-by-side on a passive silicon interposer. The interposer is placed on a ball grid array (BGA) organic substrate. Micro-bumps attach each die to the interposer, and flip-chip (C4) bumps attach the interposer to the ... » read more

High-Performance 5G IC Designs Need High-Performance Parasitic Extraction
By Karen Chow - 23 Jun, 2022 - Comments: 0

By Karen Chow and Salma Ahmed Elhenedy We are rapidly approaching a future where 5G telecommunications will be the norm. With its increased data speeds and bandwidth, 5G has the potential to change the way we live our lives. But what does that mean for the average person? Think about cellphones, for one. You don't just use your phone for calling or texting anymore—you surf the web, chec... » read more

The Evolving Digital Journey Of The Electronics Value Chain
By Matt Walsh - 26 May, 2022 - Comments: 0

Digitally transforming how the electronics value chain is traversed will unlock the full innovative potential of system design companies all over the world. By augmenting desktop authoring tools with integrated, native cloud applications that seamlessly connect companies with the electronics value chain, design teams will be empowered to confidently deliver on aggressive requirements, schedules... » read more

Formal Verification Ensures The Perseverance Rover Lands Safely On Mars
By Joseph Hupcey III - 28 Apr, 2022 - Comments: 0

By Joe Hupcey III and Kevin Campbell Safely landing a spacecraft anywhere on Mars is a complex, high-risk challenge. Even worse, the most scientifically interesting areas of the planet are guarded by boulders, ditches, and tall cliffs — land formations that aren’t very welcoming to vehicles. Such was the case with the Mars Perseverance Rover's Landing Site: Jezero Crater. It’s not an e... » read more

The Value Of RF Harmonic Balance Analyses For Analog Verification
By Pradeep Thiagarajan - 24 Mar, 2022 - Comments: 0

By Pradeep Thiagarajan and Scott Guyton The world we live in is intricately connected by electronic systems that are expected to function flawlessly to satisfy consumer needs. Functionality violations beyond certain tolerance levels are frowned upon and negatively impact the quality level of products. These systems are required to function accurately, in tandem with other interdependent syst... » read more

Dissolving The Barriers In Multi-Substrate 3D-IC Assembly Design
By Tarek Ramadan - 24 Feb, 2022 - Comments: 0

Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on top of a substrate (organic or silicon). Besides multiple dies, multiple substrates can typically exist in a 3D-IC assembly. In this case, the benefits of advanced packaging are taken to a whole ne... » read more

Dependable Verification Is The Foundation ICs Require
By Pirzad Motafram - 27 Jan, 2022 - Comments: 0

As our world becomes increasingly high-tech, it is easy to lose sight of the little things that make all of our fancy gadgets achieve optimal performance. The one thread that enables you to get all of the benefits of a new laptop, tablet, smartphone, or your automobile’s digital dashboard and connects the components that ensure best performance is the integrated circuit (IC). For as breath... » read more

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