category: Low Power-High Performance

category: IoT, Security & Automotive

Engineering Simulation Workloads And The Rise of the Cloud
By Ansys - 10 May, 2023 - Comments: 0

Cloud service providers (CSPs) continue to improve the performance capabilities of their non-accelerated and accelerated compute instances, as well as augment their HPC infrastructure with domain-area expertise of targeted HPC workloads. Additionally, engineers, researchers, and scientists are becoming more comfortable with the types of workloads that can be run in the cloud within acceptable w... » read more

Research Bits: May 10
By Jesse Allen - 10 May, 2023 - Comments: 0

Growing 2D TMDs on chips Researchers from Massachusetts Institute of Technology (MIT), Oak Ridge National Laboratory, and Ericsson Research found a way to “grow” layers of 2D transition metal dichalcogenide (TMD) materials directly on top of a fully fabricated silicon chip, a technique they say could enable denser integrations. The researchers focused on molybdenum disulfide, which is f... » read more

Achieving Your Low Power Goals With Synopsys Ultra Low Leakage IO
By Synopsys - 10 May, 2023 - Comments: 0

The demand for low power design has intensified with shrinking geometries. At the same time, innovation in battery operated, handheld devices has increased the design complexity by adding more and more functionality. The focus is on power-optimized designs while maintaining low cost and reduced risk. Designers face these complex and contradictory challenges: developing products with the lowest ... » read more

Designing Crash-Proof Autonomous Vehicles
By John Koon - 10 May, 2023 - Comments: 0

Autonomous vehicles keep crashing into things, even though ADAS technology promises to make driving safer because machines can think and react faster than human drivers. Humans rely on seeing and hearing to assess driving conditions. When drivers detect objects in front of the vehicle, the automatic reaction is to slam on the brakes or swerve to avoid them. Quite often drivers cannot react q... » read more

Research Bits: May 2
By Jesse Allen - 02 May, 2023 - Comments: 0

Reconfigurable FeHEMT Researchers at the University of Michigan created a reconfigurable ferroelectric transistor that could enable a single amplifier to do the work of multiple conventional amplifiers. “By realizing this new type of transistor, it opens up the possibility for integrating multifunctional devices, such as reconfigurable transistors, filters and resonators, on the same plat... » read more

Research Bits: April 25
By SE Staff - 25 Apr, 2023 - Comments: 0

Superconductor breakthrough — palladium Palladium may be a better superconductor than even nickelates (superconductors based on nickel), according to research by TU Wien working with Japanese universities. The research shows that palladates may be a ‘Goldilocks material’ in which it can continue its superconducting state at a higher temperature. "Palladium is directly one line below n... » read more

Research Bits: April 18
By Jesse Allen - 18 Apr, 2023 - Comments: 0

Simplified microwave photonic filter for 6G Researchers from Peking University developed a new chip-sized microwave photonic filter to separate communication signals from noise and suppress unwanted interference across the full radio frequency spectrum. “This new microwave filter chip has the potential to improve wireless communication, such as 6G, leading to faster internet connections, ... » read more

Chiplets: More Standards Needed
By Andy Heinig - 13 Apr, 2023 - Comments: 1

Recent months have seen new advances in chiplet standardization. For example, consortia such as Bunch of Wires (BoW) and Universal Chiplet Interconnect Express (UCIe) have made progress in developing standards for die-to-die (D2D) interfaces in a chiplet’s design. Far from being a new phenomenon in communication, these types of standards are established for all forms of wired and wireless com... » read more

Thermal Integrity Challenges Grow In 2.5D
By Ann Mutschler - 13 Apr, 2023 - Comments: 3

Thermal integrity is becoming much harder to predict accurately in 2.5D and 3D-IC, creating a cascade of issues that can affect everything from how a system behaves to reliability in the field. Over the past decade, silicon interposer technology has evolved from a simple interconnect into a critical enabler for heterogeneous integration. Interposers today may contain tens of dies or chiplets... » read more

What Designers Need To Know About GAA
By Brian Bailey - 13 Apr, 2023 - Comments: 3

While only 12 years old, finFETs are reaching the end of the line. They are being supplanted by gate-all-around (GAA), starting at 3nm [1], which is expected to have a significant impact on how chips are designed. GAAs come in two main flavors today — nanosheets and nanowires. There is much confusion about nanosheets, and the difference between nanosheets and nanowires. The industry still ... » read more

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