category: Low Power-High Performance

category: IoT, Security & Automotive

Multiphysics Analysis of Traction Motors: Accelerating Innovation in Electric Mobility Solutions
By Ansys - 11 Jan, 2023 - Comments: 0

Between 2021 and 2023, electric vehicles (EVs) represent a $7 trillion market opportunity, and it’s only projected to increase. In a rapidly growing EV market, automakers are turning to advanced design, testing, and manufacturing technologies. Optimized system design requires the evaluation of many different concepts, topologies, and electronic interactions across disciplines. Design and s... » read more

On The Reverse Breakdown Behavior Of GaAs PIN Diodes For High Power Applications
By Fraunhofer IIS/EAS - 11 Jan, 2023 - Comments: 0

In the field of power electronics, the compound semiconductors gallium nitride and silicon carbide are dominating the market. Due to its beneficial properties, gallium arsenide is gaining more and more importance. The aim is to manufacture devices based on gallium arsenide for use in power electronics with comparable or better properties, but at lower costs. In this work, a first GaAs PIN diode... » read more

What’s The Difference Between An NPU And A GPNPU?
By Quadric.io - 11 Jan, 2023 - Comments: 0

To understand the difference between an NPU (neural processing unit) and a GPNPU (general-purpose neural processing unit) let’s start with the NPU, a processing engine that accelerates machine learning (ML) workloads in System on Chip (SoC) designs. Click here to read more. » read more

Achieving Greater Accuracy In Real-Time Vision Processing With Transformers
By Gordon Cooper - 10 Jan, 2023 - Comments: 0

Transformers, first proposed in a Google research paper in 2017, were initially designed for natural language processing (NLP) tasks. Recently, researchers applied transformers to vision applications and got interesting results. While previously, vision tasks had been dominated by convolutional neural networks (CNNs), transformers have proven surprisingly adaptable to vision tasks like image cl... » read more

Choosing The Right Memory At The Edge
By Ed Sperling - 09 Jan, 2023 - Comments: 0

As the amount of data produced by sensors in cars and phones continues to grow, more of that data needs to be processed locally. It takes too much time and power to send it all to the cloud. But choosing the right memory for a particular application requires a series of tradeoffs involving cost, bandwidth, power, which can vary greatly by device, application, and even the data itself. Frank Fer... » read more

Research Bits: Jan. 9
By Jesse Allen - 09 Jan, 2023 - Comments: 0

Making stretchy semiconductors Researchers from Pennsylvania State University, University of Houston, Purdue University, and Texas Heart Institute developed a new method to make soft, stretchable transistors easier and cheaper to manufacture. The lateral phase separation induced micromesh (LPSM) process involves mixing a semiconductor and an elastomer and spin coating the liquid mixture pre... » read more

Research Bits: Jan. 3
By Jesse Allen - 03 Jan, 2023 - Comments: 0

Printing electronics on curved surfaces Researchers from North Carolina State University have demonstrated a new technique for directly printing electronic circuits onto curved and corrugated surfaces. They have used the technique to create prototype “smart” contact lenses, pressure-sensitive latex gloves, and transparent electrodes. “There are many existing techniques for creating pr... » read more

Facing Off Against Growing Chip Design Complexity
By Kelly Damalou - 19 Dec, 2022 - Comments: 0

The semiconductor industry continues to face incredible pressures to deliver higher levels of performance in a smaller area, with lower power demands. From high-performance systems-on-chip for 5G mobile devices and network infrastructure to the radio-frequency transceivers that enable autonomous vehicles and the industrial Internet of Things, today’s applications demand a reduced profile, pai... » read more

3D-IC Reliability Degrades With Increasing Temperature
By Ann Mutschler - 14 Dec, 2022 - Comments: 0

The reliability of 3D-IC designs is dependent upon the ability of engineering teams to control heat, which can significantly degrade performance and accelerate circuit aging. While heat has been problematic in semiconductor design since at least 28nm, it is much more challenging to deal with inside a 3D package, where electromigration can spread to multiple chips on multiple levels. “Be... » read more

Research Bits: Dec. 13
By Jesse Allen - 13 Dec, 2022 - Comments: 0

Electronic-photonic interface for data centers Engineers at Caltech and the University of Southampton integrated an electronic and photonic chip for high-speed communication in data centers. "There are more than 2,700 data centers in the U.S. and more than 8,000 worldwide, with towers of servers stacked on top of each other to manage the load of thousands of terabytes of data going in and o... » read more

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