category: Low Power-High Performance

category: IoT, Security & Automotive

Thermal Cycling Failure In Electronics
By Kelly Morgan - 19 Jul, 2022 - Comments: 0

Each time a device is turned off and on, its temperature changes. (Just think about how often your phone lights up all day.) Energy flowing through several layers of tightly stacked materials causes devices to heat up, then rapidly cool down. This repeated oscillation between temperatures over the lifetime of a device is called thermal cycling. Why thermal management is important Thermal cycl... » read more

Thermally Optimizing A High-Power PCB
By Cadence - 18 Jul, 2022 - Comments: 0

The growth of battery-powered applications is presenting new challenges for designers of electronic motor-driven solutions. Targeting higher performance and efficiency, the power stages of these products must manage high currents while meeting strict power dissipation and size requirements. This white paper illustrates a thermally aware workflow with the Cadence® Celsius™ Thermal Solver... » read more

Introduction To The Arm Cortex-M55 Processor
By Arm - 18 Jul, 2022 - Comments: 0

This white paper covers the technical details, including pipeline, floating-point support and features of Arm Cortex-M55 processor. The Arm Cortex-M55 processor is Arm’s most AI-capable Cortex-M processor and the first to feature Arm Helium vector processing technology, bringing enhanced, energy efficient signal processing and machine learning (ML) performance. Click here to read more. » read more

Post Quantum Cryptography Is Coming
By Rambus - 18 Jul, 2022 - Comments: 0

Quantum computing has made big advances in recent years and experts agree that quantum computers capable of breaking 2048-bit RSA or 256-bit ECC will be built — it’s just a matter of time. In this white paper, we discuss the security algorithms NIST has selected for Post Quantum Cryptography (PQC) and their instantiation in Rambus security products. Download this white paper to learn: ... » read more

Verify Perception Systems Virtually Via Accurate Fog Models
By Ansys - 18 Jul, 2022 - Comments: 0

Under every lighting level and weather condition, cameras must reliably “see” pedestrians and other physical objects ― and trigger an appropriate reaction from critical systems such as braking. This is especially challenging in foggy conditions, which can confuse visual cameras, radar, lidar and other conventional sensor technologies. Thermal imaging represents a potential solution, helpi... » read more

MIPI In Next Generation Of AI IoT Devices At The Edge
By Mixel - 18 Jul, 2022 - Comments: 0

The history of data processing begins in the 1960’s with centralized on-site mainframes that later evolved into distributed client servers. In the beginning of this century, centralized cloud computing became attractive and began to gain momentum becoming one of the most popular computing tools today. In recent years however, we have seen an increase in the demand for processing... » read more

Research Bits: July 18
By Jesse Allen - 18 Jul, 2022 - Comments: 0

CXL memory disaggregation Researchers from the Korea Advanced Institute of Science and Technology (KAIST) developed a Compute Express Link (CXL) solution for directly accessible, high-performance memory disaggregation that they say significantly improves performance compared to existing remote direct memory access (RDMA)-based memory disaggregation. RDMA enables a host to directly access an... » read more

Research Bits: July 11
By Jesse Allen - 11 Jul, 2022 - Comments: 0

Modeling ALE Scientists at U.S. Department of Energy’s (DOE) Princeton Plasma Physics Laboratory (PPPL), in coordination with Lam Research, modeled atomic layer etching (ALE) for semiconductor fabrication. “This would be one little piece in the whole process,” said David Graves, associate laboratory director for low-temperature plasma surface interactions at PPPL and a professor in th... » read more

Electromagnetic Simulation And 3D-IC Interposers
By Matt Commens - 11 Jul, 2022 - Comments: 0

By Matt Commens, Juliano Mologni, and Pete Gasperini Today’s 3D integrated circuit (3D-IC) technology is the culmination of 40 years of research in universities and laboratories scattered across the globe. Beginning with dynamic random-access memory (DRAM) deployments that appeared on the market a decade ago, 3D-IC has since expanded its reach. It is now decisively beginning to achieve the... » read more

Startup Funding: June 2022
By Jesse Allen - 06 Jul, 2022 - Comments: 0

Big money went to manufacturing in June, with a massive round for a Chinese analog foundry’s expansion to 55 – 40nm nodes. A fab management software startup also drew sizeable investment, as did a supplier of semiconductor-grade silicon components. Investors didn’t forget chip design, with three EDA companies receiving new funding, one of which drew over $100 million. Plus, numerous te... » read more

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