category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

Stacked Die Changes
By Ed Sperling - 27 Jul, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss advanced packaging with David Pan, associate professor in the department of electrical and computer engineering at the University of Texas; Max Min, senior technical manager at Samsung; John Hunt, senior director of engineering at ASE; and Sitaram Arkalgud, vice president of 3D portfolio and technologies at Invensas. What follows are excerpts of tha... » read more

Manufacturing Bits: July 26
By Mark LaPedus - 26 Jul, 2016 - Comments: 0

Jumping films Riken and the University of Tokyo have developed a tiny autonomous actuator. The actuator, which is based on a special material, can automatically curl up or straighten out when exposed to ambient humidity. And in certain conditions, the film can even jump into the air by itself. A video can be seen here. Researchers placed a material called guanidinium carbonate into a hig... » read more

RF GaN Gains Steam
By Mark LaPedus - 25 Jul, 2016 - Comments: 0

The RF [getkc id="217" kc_name="gallium nitride"] (GaN) device market is heating up amid the need for more performance with better power densities in a range of systems, such as infrastructure equipment, missile defense and radar. On one front, for example, RF GaN is beginning to displace a silicon-based technology for the power amplifier sockets in today’s wireless base stations. GaN is m... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 Jul, 2016 - Comments: 2

Market research Worldwide semiconductor capital spending is projected to decline 0.7% in 2016, to $64.3 billion, according to Gartner. This is up from the estimated 2% decline in Gartner's previous quarterly forecast. "Economic instability, inventory excess, weak demand for PC’s, tablets, and mobile products in the past three years has caused slow growth for the semiconductor industry. This ... » read more

Roots Of Distrust Spread
By Ed Sperling - 21 Jul, 2016 - Comments: 0

For most of the history of semiconductors there has been a persistent fear that someone would steal intellectual property from one company and sell it to another. There have been innumerable lawsuits involving corporate secrets that cross from one company to the next, and from one country to the next. The biggest concerns always were at the leading edges of technology, where those secrets w... » read more

5 Takeaways From Semicon
By Mark LaPedus - 21 Jul, 2016 - Comments: 0

As usual, the recent Semicon West trade show was a busy, if not an overwhelming, event. The event, which took place in San Francisco in early July, featured presentations on the usual subjects in the semiconductor and IC-equipment sectors. There were sessions on 200mm, next-generation processes, transistors, lithography, MEMS and many others. In no particular order, here are my five ta... » read more

Material And Process Challenges In A Changing Memory Landscape
By Er-Xuan Ping - 21 Jul, 2016 - Comments: 0

Moore’s Law has fueled the semiconductor industry’s growth for decades. But as the complexity of scaling increases, extending the economics of Moore’s Law is becoming a challenge. One example illustrating the challenges of maintaining the economic benefits of Moore’s Law is the difficulty of IC chip patterning. Today, this requires an expensive litho scanner, a complicated spacer and... » read more

Colorless vs. Colored Double-Patterning Design Flows
By David Abercrombie - 21 Jul, 2016 - Comments: 0

Colored vs. Colorless double patterning design flows—do you know which one is best for your design? What options does your foundry allow? Do you debug one differently from the other? In this short video, I’ll demonstrate the differences between colored and colorless DP design flows, and explain the options and potential pitfalls of each approach. With a better understanding of how to design... » read more

Pattern Dependence Process Modeling
By Joseph Ervin - 21 Jul, 2016 - Comments: 0

First order process modeling can help tremendously with process setup and integration challenges that occur in a semiconductor fabrication flow, by visualizing process variation problems “virtually” prior to actual fabrication. In some instances, a deeper level of complexity needs to be added to the process model to capture the effects of variation in the process. Specific examples inclu... » read more

3D Printing: What Does It Mean For The Semiconductor Industry?
By Adrienne Downey - 21 Jul, 2016 - Comments: 0

Semico Research was pleased to host the 3D printing TechXPOT at SEMICON West 2016, in conjunction with SEMI. We also hosted the inaugural 3D printing session at SEMICON West 2014. What is striking is how much the 3D printing industry has changed in those two years. In 2014, 3D printing was at the height of media attention; the major questions were when each home would have its own 3D printer. I... » read more

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