Automotive MEMS Accelerometer Design Verification: A Real Life Example

By Arnaud Parent - 15 Dec, 2022 - Comments: 0

Standard Finite Element (FE) models, especially those that incorporate multiple physical domains, consist of detailed representations of a device that include a large number of Degrees of Freedom (DoF). The Degrees of Freedom in a design are the number of independent variables or parameters needed to describe the motion or state of the device. Generally, the larger the number of Degrees of Free... » read more

A New Dimension In Optical CD

By Ilya Osherov - 15 Dec, 2022 - Comments: 0

One of the biggest challenges for nanoscale fabrication is how to measure devices on such a minute scale. As the semiconductor industry demands ever smaller devices, the need for reliable, robust measurements for quality control and process optimization increases. One robust and commonly used technique in semiconductor manufacturing is optical critical dimension (OCD) metrology. Standard, al... » read more

Driving Toward Net-Zero: Key Takeaways From Semiconductor Sustainability Summit

By Ashley Huang - 15 Dec, 2022 - Comments: 0

To address the climate crisis, countries around the world are pursuing ambitious targets to achieve net-zero carbon emissions by 2050 under the Paris Agreement. In March, Taiwan redoubled its focus on decarbonization by announcing its net-zero pathway, while its Environmental Protection Administration (EPA) under the Executive Yuan is reshaping the Greenhouse Gas Reduction and Management Act in... » read more

Heterogeneous Integration Issues And Developments

By Ed Sperling - 14 Dec, 2022 - Comments: 0

There are a slew of new developments in advanced packaging, from new materials, chiplets, and interconnect schemes, to challenges involving how to physically put chips in a package, metallization, thermal cycling, and parasitics in the interconnect path. Dick Otte, CEO of Promex Industries, talks about how this will change chip design and manufacturing, and how those changes are likely to unfol... » read more

Pathfinding By Process Window Modeling: Advanced DRAM Capacitor Patterning Process Window Evaluation Using Virtual Fabrication

By Coventor - 14 Dec, 2022 - Comments: 0

In advanced DRAM, capacitors with closely packed patterning are designed to increase cell density. Thus, advanced patterning schemes, such as multiple litho-etch, SADP and SAQP processes may be needed. In this paper, we systematically evaluate a DRAM capacitor hole formation process that includes SADP and SAQP patterning, using virtual fabrication and statistical analysis in SEMulator3D. The pu... » read more

Nova METRION Use Cases

By Nova - 14 Dec, 2022 - Comments: 0

Several use cases that we will explore for the Nova METRION® system include contamination control, process excursion prevention, reactor matching, and uniformity control. The objectives of these use cases are to detect contaminants which can kill devices, improve barrier layer and source/drain function, maintain deposition uniformity that impacts downstream processes, and ensure wafer-to-wafer... » read more

Meeting Cost And Technology Requirements Using MLF/QFN

By Amkor - 14 Dec, 2022 - Comments: 0

MicroLeadFrame (MLF)/ quad flat no-lead (QFN) packaging technology is the fastest growing IC packaging solution today. From a market segment perspective, MLF packaging solutions represent more than a 111B-unit market for 2022 across five markets: automotive, consumer, industrial, networking, and communications (Figure 1). The package solution requirements across these markets vary but, the fund... » read more

SEMI’s Year-End Total Semiconductor Equipment Forecast — OEM Perspective, 2022

By SEMI - 14 Dec, 2022 - Comments: 0

Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to reach a new high of $108.5 billion in 2022, rising 5.9% from the previous industry record of $102.5 billion in 2021, SEMI announced today in its Year-End Total Semiconductor Equipment Forecast – OEM Perspectiveat SEMICON Japan 2022. The record high caps three consecutive years of re... » read more

Samsung PM9A3 All Flash Reference Platform

By Samsung - 14 Dec, 2022 - Comments: 0

Software Defined Storage continues to gain momentum in the modern datacenter storage market. As datacenter storage in- frastructures and technologies evolve, the need for speed and flexibility in the storage system becomes evident. NVMe is at the forefront of these advancements. Weka is a software defined storage system that is designed to meet the needs of today’s I/O intensive workloads. It... » read more

Increased Photomask Density And Its Impact On EDA

By Ed Sperling - 13 Dec, 2022 - Comments: 0

The ability to print curvilinear shapes on photomasks can have big repercussions on semiconductor design. Aki Fujimura, CEO of D2S, explains why mask rule checking has been bound by complex design rules, and why curvilinear shapes are important for reducing margin and simplifying the chip design process. » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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