Chiplets Enter The Supercomputer Race

By Mark LaPedus - 17 Mar, 2022 - Comments: 0

Several entities from various nations are racing each other to deliver and deploy chiplet-based exascale supercomputers, a new class of systems that are 1,000x faster than today’s supercomputers. The latest exascale supercomputer CPU and GPU designs mix and match complex dies in advanced packages, adding a new level of flexibility and customization for supercomputers. For years, various na... » read more

Accelerating Semiconductor Process Development Using Virtual Design Of Experiments

By Qingpeng Wang - 17 Mar, 2022 - Comments: 0

Design of Experiments (DOE) are a powerful concept in semiconductor engineering research and development. DOEs are sets of experiments used to explore the sensitivity of experimental variables and their effect on final device performance. A well-designed DOE can help an engineer achieve a targeted semiconductor device performance using a limited number of experimental wafer runs. However, in se... » read more

Precision Selective Etch And The Path To 3D

By Vahid Vahedi - 17 Mar, 2022 - Comments: 0

Scaling (the shrinking of the tiny devices in chips such as transistors and memory cells) has never been easy, but making the next generation of advanced logic and memory devices a reality requires creating new structures at the atomic scale. When working with dimensions this small, there is little room for variation. Compounding the problem is a need to remove material isotropically, or, un... » read more

GaN ICs Wanted for Power, EV Markets

By Katherine Derbyshire - 17 Mar, 2022 - Comments: 0

Circuits built with discrete GaN components may get the job done, but fully integrated GaN circuits remain the ultimate goal because they would offer many of the same advantages as integrated silicon circuits. These benefits include lower cost as the circuit footprint is scaled, and reduced parasitic resistance and capacitance with shorter interconnect runs. In addition, improved device perf... » read more

The Great Resignation And The Microelectronics Industry: Retaining A Skilled Workforce

By Michelle Williams-Vaden - 17 Mar, 2022 - Comments: 0

"Now hiring" signs are replacing masks and bottles of hand sanitizer as the ubiquitous markers of COVID-19, as the Great Resignation continues, and the Omicron surge ebbs. Everywhere – at fast food restaurants, at top tech companies – there are job openings, offering cash just for showing up at an interview, or up to $100,000 in sign-on bonuses. Consumers across all industries are bein... » read more

The Challenge Doesn’t Stop At Certification: Post-B Corp Certification Reflections

By Jessica Albright - 17 Mar, 2022 - Comments: 0

Nearly one year after becoming the semiconductor industry’s first Certified B Corporation by meeting the highest standards of social and environmental responsibility, Brewer Science still finds itself faced with a number challenges associated with upholding the B Corp mission. Following are five main challenges we are working to tackle in our ongoing pursuit to fulfill the B Corp missi... » read more

Survey: 2022 Deep Learning Applications

By eBeam Initiative - 16 Mar, 2022 - Comments: 0

The 2022 member list of deep learning projects and products that eBeam members are working on in photomask to wafer semiconductor manufacturing. Participating companies include Advantest, ASML, Canon, CEA-LETI, D2S, Fraunhofer IPMS, Hitachi High-Tech Corporation, imec, NuFlare Technology, Siemens Industries Software, Inc.; Siemens EDA, STMicroelectronics, and TASMIT. Click here to see the su... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 11 Mar, 2022 - Comments: 0

Chipmakers and OEMs Apple has rolled out its most powerful processor, dubbed the M1 Ultra, a multi-die chip that incorporates the company's new packaging technology. The M1 Ultra is incorporated in Apple’s new Mac Studio desktop. M1 Ultra features a 20-core CPU, a 64-core GPU, and a 32-core Neural Engine. The M1 Ultra also features UltraFusion, Apple’s new packaging architecture. M1 Ult... » read more

Technical Papers: Organized, Timely, And Relevant

By Ed Sperling - 09 Mar, 2022 - Comments: 1

Engineers and scientists from every discipline linked to semiconductors have been struggling for years to find good research papers about trends and topics they care about, and the situation is only getting worse as the technology becomes more complex and the supply chain becomes more diverse and distributed. There are a slew of new issues in manufacturing, packaging, and design, and there a... » read more

Next-Gen Transistors

By Ed Sperling - 07 Mar, 2022 - Comments: 0

Nanosheets, or more generally, gate-all-around FETs, mark the next big shift in transistor structures at the most advanced nodes. David Fried, vice president of computational products at Lam Research, talks with Semiconductor Engineering about the advantages of using these new transistor types, along with myriad challenges at future nodes, particularly in the area of metrology. » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.