What’s Next For Transistors And Chiplets

By Mark LaPedus - 21 Oct, 2021 - Comments: 5

Sri Samavedam, senior vice president of CMOS Technologies at Imec, sat down with Semiconductor Engineering to talk about finFET scaling, gate-all-around transistors, interconnects, packaging, chiplets and 3D SoCs. What follows are excerpts of that discussion. SE: The semiconductor technology roadmap is moving in several different directions. We have traditional logic scaling, but packaging i... » read more

High Thermal Die-Attach Paste Development For Analog Devices

By Amkor - 20 Oct, 2021 - Comments: 0

Authors: Kiichiro Higaki, Toru Takahashi, Akinori Ono from Assembly Engineering Department Amkor Technology Japan, Inc. Keiichi Kusaka, Takayuki Nishi, Takeshi Mori from Information & Telecommunication Materials Research Laboratory, Sumitomo Bakelite Company, Limited Daisuke Koike, Masahiko Hori from Package Solution Technology Development Department, Electronic Devices & Storage Res... » read more

Manufacturing Bits: Oct. 19

By Mark LaPedus - 19 Oct, 2021 - Comments: 0

Solar mini-reactors The University of Amsterdam has developed a standalone solar-powered mini-reactor. The technology could one day serve as an autonomous off-grid photochemistry system for remote locations. The prototype solar reactor measures 0.25 square meters. The system is equipped with a solar cell, which provides the power for the pumps and control system. This solar cell is placed ... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 15 Oct, 2021 - Comments: 0

Chipmakers TSMC posted its results for the quarter and confirmed its long-awaited plans to build a fab in Japan. It’s not a leading-edge fab, but rather a plant for 28nm/22nm processes. “The company confirmed plans to build a new fab in Japan for 22nm + 28nm,” said Aaron Rakers, an analyst at Wells Fargo, in a research note. “An average 22/28nm fab costs ~$4-5B range per 45k wspm. Fab ... » read more

Manufacturing Bits: Oct. 11

By Mark LaPedus - 11 Oct, 2021 - Comments: 0

IC security using AFMs The National Institute of Standards and Technology (NIST) has developed a probe assisted doping technique (PAD), a technology that could help prevent counterfeit chips and electronic devices from entering the market. PAD involves creating a unique ID tag on every chip using an atomic force microscope (AFM). Basically, an AFM system incorporates a cantilever with a tin... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 08 Oct, 2021 - Comments: 0

Government policy Hoping to resolve the ongoing worldwide chip shortage situation, the U.S. Department of Commerce late last month launched a “request for information (RFI)” initiative, which involved sending questionnaires to various semiconductor companies. The U.S. government is asking all parts of the supply chain – producers, consumers, and intermediaries – to voluntarily share in... » read more

Fan-Out And Packaging Challenges

By Mark LaPedus - 06 Oct, 2021 - Comments: 2

Semiconductor Engineering sat down to discuss various IC packaging technologies, wafer-level and panel-level approaches, and the need for new materials with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced packaging development and integration at Amkor; Richard Otte, president and CEO of Promex, the parent company of QP Technologies; Michael Liu, senior director of globa... » read more

Manufacturing Bits: Oct. 5

By Mark LaPedus - 05 Oct, 2021 - Comments: 0

EUV lithography storage ring At the recent SPIE Photomask Technology + EUV Lithography conference, Japan’s High Energy Accelerator Research Organization (KEK) presented a paper on its latest efforts to develop a free-electron laser (FEL) storage ring source power unit for extreme ultraviolet (EUV) lithography. KEK has demonstrated a proof-of-concept EUV-FEL, which has been in R&D. EUV-FEL... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 01 Oct, 2021 - Comments: 0

Market research For some time, the semiconductor industry has experienced acute shortages. The automotive industry has suffered the most. When will this all end? “Shortages have become more acute for many products in the near term because the growth in demand is greater than the increase in wafer and packaging capacity that was anticipated by the foundry and semiconductor vendors. To date... » read more

Open Cavity Plastic Packaging

By Ed Sperling - 30 Sep, 2021 - Comments: 0

Rapid change in electronics is also causing rapid obsolescence. But in some markets, the systems are supposed to last for decades. Sam Sadri, senior process engineer at QP Technologies (formerly Quik-Pak), talks with Semiconductor Engineering about why it’s so important to use existing package footprints, what are the challenges in replacing the circuitry inside a package, and which markets a... » read more

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category: Manufacturing, Packaging and Materials

category: IoT, Security & Automotive

What’s Next For Transistors And Chiplets

High Thermal Die-Attach Paste Development For Analog Devices

Manufacturing Bits: Oct. 19

Week In Review: Manufacturing, Test

Manufacturing Bits: Oct. 11

Week In Review: Manufacturing, Test

Fan-Out And Packaging Challenges

Manufacturing Bits: Oct. 5

Week In Review: Manufacturing, Test

Open Cavity Plastic Packaging